1.
Study on curing reaction kinetics and properties of epoxy potting compound
环氧灌封料固化反应动力学及其性能研究
2.
Application of Silicone to Epoxy Encapsulating Materals and Potting Compound
有机硅在环氧包封料、灌封料中的应用
3.
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
环氧树脂灌封材料的制备与性能研究
4.
The influence of filler on the properties of epoxy encapsulating materials
硅微粉填料对环氧灌封材料性能的影响
5.
Preparation and Characterization of Lightweight and Higher Resistance to Impact Epoxy Encapsulating Materials
轻质抗冲击环氧灌封材料的制备与表征
6.
Preparation and characterization of epoxy encapsulating materials toughened by polyurethane
聚氨酯增韧环氧灌封材料的制备与表征
7.
Properties of Polyurethane-Modified Epoxy Resin Encapsulating Materials Filled with Glass Fiber
玻璃纤维填充聚氨酯改性环氧树脂灌封材料的性能
8.
Study on synthesis and mechanics performance of encapsulating materials based on nano-SiO_2/epoxy resin
纳米SiO_2/环氧树脂灌封材料的制备和力学性能研究
9.
Effect of Grafted Particles PGMA/Al_2O_3 on Toughness and Reinforce of Encapsulating Materials of Epoxy Resin
接枝微粒PGMA/Al_2O_3对环氧树脂电子灌封材料的增强增韧作用
10.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
11.
epoxy pouring sealant for high-voltage focusing potentiometer
高压聚焦电位器环氧灌封胶
12.
Study of high performance epoxy gap-filling and application process
高强环氧灌浆料及其施工工艺的研究
13.
Study of Some Problems in Environmental Friendly Improvement of Epoxy Molding Compounds
环氧塑封料绿色环保化过程中的问题研究
14.
DEVELOPMENT OF EPOXY/EPOXY-SILSESQUIOXANE HYBRID MATERIAL FOR LED PACKAGING
LED封装用环氧树脂/环氧倍半硅氧烷杂化材料的研制
15.
Preparation and Properties of Epoxy Electronic Encapsulating Materials with High Thermal Conductivity and Low Thermal Expansion Coefficient;
高导热低膨胀环氧塑封料的制备及性能研究
16.
The Develop of the Cement Concrete Pavement Crack Epoxy Grouting Material;
水泥混凝土路面裂缝环氧灌浆材料的研制
17.
Composition of Epoxy Resin Grouts and Their Modified Research and Application;
环氧树脂灌浆材料的配制及其改性研究与应用
18.
Study on properties of cationic waterborne epoxy grouting material
阳离子型水性环氧树脂灌浆材料的性能研究