1) IC package model
IC封装模型
2) IC packaging
IC封装
1.
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
2.
The process of design for clamping unit of auto molding in IC packaging was introduced,and finite element model of clamping unit was established.
介绍了IC封装热压模机合模机构的设计过程,建立了合模机构的有限元模型,运用有限元分析软件ANSYS对合模机构的关键部位进行了应力、变形分析,得出了该机构的应力变形分布图,为进一步改进机构的受力情况和结构设计提供了重要依据。
3.
In this paper, new developmental trends for the miniaturization of IC packaging are introduced.
IC封装的最主要的发展方向是小型化。
3) IC package
IC封装
1.
By adding pattern recognition system to IC package equipment, a manual wire-bonder to automatic one was successfully ameliorated.
把图像识别系统应用于IC封装设备中,成功将手动式金丝球焊机改造为全自动金丝球焊机; 根据金丝球焊机的高速度、高精度要求,系统采取了梯形分层搜索的序贯相关判决图像识别算法,采用了步进电机细分驱动凸轮、凸轮直接驱动V型导轨平台的控制方法,获得了低成本、高效率的效果。
2.
As IC chips are fast developing toward higher density, higher performance and smallersize, to meet the demands of IC package, back thinning of the patterned wafer is one of most impor-tant procedure in the backend of semiconductor manufacturing process.
集成电路芯片不断向高密度、高性能和轻薄短小方向发展,为满足IC封装要求,图形硅片的背面减薄成为半导体后半制程中的重要工序。
3.
The development and requirements for the IC package and substrate technology were summarized.
介绍了半导体IC封装技术和封装基板的技术发展需求,阐述了双马来酰亚胺树脂的改性方法及其在封装基板上的应用,分析了三菱瓦斯化学公司的双马来酰亚胺-三嗪树脂(BT树脂)材料封装基板的特性,结果表明,该树脂可满足封装领域的技术要求,应用前景广阔。
4) packaging for ultra-thin ICs
超薄型IC封装技术
5) model encapsulation
模型封装
补充资料：IC封装
封装:指把硅片上的电路管脚,用导线接引到外部接头处,以便与其它器件连接.
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条