1.
Encapsulation Model of Product Configuration Knowledge and Its Application in the Mould
产品配置知识封装模型及其在模架设计中的应用
2.
Development&Application of Tracking Filter Based on Closed-Form Modeling of SMD;
基于贴片元件封装模型的宽范围跟踪滤波网络的设计与应用
3.
The Design and Realization of Encapsulation and Access Modeling on Modules
模块的封装与调用模型的设计与实现
4.
Expansion and Solution on Mathematical Model of Mistaken-filling Envelope;
“装错信封问题”数学模型的求解及推广
5.
Web Service Encapsulation of FORTRAN-based Geographical Model
FORTRAN地理模型的服务化封装
6.
Model of identity authentication based on secure packaging FPGA
基于FPGA安全封装的身份认证模型研究
7.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命
8.
Improvement on the Packaging Process of 1X2 Single Mode FBT Fiber Splitters
1X2单模融拉型光纤分路器封装工艺的改进
9.
Research on Theoretic Model & Its Package Types of the Bidirectional IGBT
双向IGBT理论模型及其封装形式可行性研究
10.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
11.
Design of GFP Encapsulation and De-encapsulation Module in EoS
EoS中GFP封装与解封装模块的设计
12.
TQFP (Thin Plastic Quad Flat Pack
薄型方面平面封装)
13.
The paper also researches the information model of the system and the encapsulation of knowledge tree.
研究了知识管理子系统的资讯模型和知识树类的封装。
14.
Study on Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in Microelectronic Packaging;
微电子封装中无铅焊料的损伤模型和失效机理研究
15.
Time-Dependent Damage Coupled Constitutive Model of Solder Alloy in Micro-Electronic Packaging at High Tempertaure and It's Application;
微电子封装钎料高温时相关耦合损伤本构模型及其工程应用
16.
A New Quick-Opening Seal Structure and Numerical Simulation for Pressure Reactor in Supercritical Technology
超临界技术中新型高压快开密封装置及其数值模拟分析
17.
closed linear model of production
封闭式的线性生产模型
18.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景