1.
Design of the Control System of the Wafer Expanding Device for IC Encapsulation
IC封装的扩晶装置控制系统的设计
2.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素
3.
High-density IC Packaging Based on Flexible Printed Circuit
基于挠性基板的高密度IC封装技术
4.
The Investigation of 2-DOF High-speed and High-precision Positioning System for IC Packaging;
面向IC封装的两自由度高速精密定位系统研究
5.
Design and Optimization for the Bonding Head with Parallel Mechanism Based on IC Encapsulation;
基于IC封装的并联焊头机构的设计与优化
6.
The Research of IC Packaging Successful Factor and Core Competence;
IC封装企业成功要素的探讨与核心能力的培育
7.
Design and Investigation of High-Speed and High-precision Positioning System for IC Packaging;
面向IC封装的高速精密定位系统设计与研究
8.
Research on Computer Vision Positioning System for IC Packaging
面向IC封装的计算机视觉定位系统的研究
9.
Trajectory Planning and Motion Control Base on the IC Chip Die-bonder with Parallel Mechanism;
基于IC封装的并联焊头机构的轨迹规划及其运动控制
10.
Study on Control Algorithm Simulation of High-Speed and High-Precision Positioning System for IC Package
面向IC封装的高速高精密定位系统控制算法仿真研究
11.
Synthesis of Hexaphenoxyl Cyclotriphosphazene and Its Flame Retardance on Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯氧基环三磷腈的合成及对IC封装用EMC的无卤阻燃
12.
System Research for Analysis the Package Thermal Reliability of IC Chips Based on Electronic Speckle Pattern Interferometer
基于激光电子散斑技术的IC芯片封装热可靠性分析系统研究
13.
the design and implementation of an IC equipment driver encapsulation based on Java
一种基于跨平台的IC设备驱动封装的设计与实现
14.
Kinematic Analysis and Design of a Parallel Robot for Wafer Transfer
IC制造装备中专用机器人运动学分析与设计
15.
Inspection of surface mounted IC devices with edge and color features
综合边缘和颜色特征的IC类贴装器件的检测
16.
Uncertainty Evaluation for Time Billing Device of IC Card Public Telephone
IC卡公用电话计时计费装置不确定度的评定
17.
sealing device [ballot box]
封箱装置〔投票箱〕
18.
Front Oil Seal Installer 6635
前油封安装器6635