1) mixed count
混点
2) Mixed solder joint
混合焊点
1.
Research progress of mixed solder joint reliability in lead-free transition;
无铅过渡时期混合焊点可靠性研究进展
2.
In the transition from lead to lead-free,for the manufacturers of electronic products,there is expected to be a period when lead and lead-free materials will be used within the same mounting process,the mixed solder joint which formed in this situation is very complicated.
在从有铅向无铅转换过程中,电子产品制造商不可避免会碰到同一组装过程中有铅和无铅同时存在的混合情况,这种情况下形成的混合焊点是很复杂的。
3) blending characteristics
混合特点
4) mixed solder joints
混合焊点
1.
Reliability study on mixed solder joints of SMD resistor under thermal cycle load;
片式电阻混合焊点热循环负载可靠性研究
2.
In the transition,solder from lead to lead-free,there is expected to be a period when the lead and lead-free will be mixed used,so it is necessary to study the reliability of the mixed solder joints.
焊料从有铅向无铅转换中,不可避免会遇到二者混合使用的情况,有必要对生成的混合焊点进行可靠性研究。
3.
The thermalfatigue life of mixed solder joints is predicted by using submodel and the Darveauxequation, and then compared with other kinds of solder joints.
对于混合焊点,从设计到材料,再到整个组装工艺都没有标准可循,焊点的可靠性问题将更加突出,组装工艺更难控制。
5) Vertex Blending
顶点混合
1.
A model for the whole hand was built according to its acting characteristic, the raw data of Cyeber-Glove joints was effectively adjusted, and then through vertex blending on programmable graphics hardware, the adjusted data was appl.
在此根据虚拟手的运动特点对其进行整体建模,并快捷地对数据手套采集的原始关节数据进行校正,在可编程图形硬件上利用顶点混合算法将校正后的数据作用于虚拟手模型来产生皮肤变形,在满足实时性的同时提供了逼真的视觉效果。
6) Combination lattices
混合格点
补充资料：摩尔混点升高常数
分子式：
CAS号：
性质：1000g纯溶剂中加入1mol溶质后的沸点升高值。它是仅与溶剂性质有关的常数，常以Kb表示。Kb=R·M1/ΔH1。式中，R气体常数，4.1868J/（℃·mol）；T纯溶剂沸点，℃；M1溶剂分子量；ΔH溶剂蒸发潜热，4.1868J/mol。
CAS号：
性质：1000g纯溶剂中加入1mol溶质后的沸点升高值。它是仅与溶剂性质有关的常数，常以Kb表示。Kb=R·M1/ΔH1。式中，R气体常数，4.1868J/（℃·mol）；T纯溶剂沸点，℃；M1溶剂分子量；ΔH溶剂蒸发潜热，4.1868J/mol。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条