Research progress of mixed solder joint reliability in lead-free transition;

In the transition from lead to lead-free,for the manufacturers of electronic products,there is expected to be a period when lead and lead-free materials will be used within the same mounting process,the mixed solder joint which formed in this situation is very complicated.

Reliability study on mixed solder joints of SMD resistor under thermal cycle load;

In the transition,solder from lead to lead-free,there is expected to be a period when the lead and lead-free will be mixed used,so it is necessary to study the reliability of the mixed solder joints.

The thermalfatigue life of mixed solder joints is predicted by using submodel and the Darveauxequation, and then compared with other kinds of solder joints.

A model for the whole hand was built according to its acting characteristic, the raw data of Cyeber-Glove joints was effectively adjusted, and then through vertex blending on programmable graphics hardware, the adjusted data was appl.