1) silicon-grass direct bonding(SGDB)
Si-玻璃直接键合(SGDB)
2) Si/Si direct bonding
Si/Si直接键合
1.
A physical model of the interfacial stresses of Si/Si direct bonding was presented based on the Suhire theory of stresses presented in bimetal strips,and the analytical equations of the normal stresses,the shearing stresses and the peeling stresses were derived according to the stress model.
根据Suhir的双金属带的热应力分布理论,建立了Si/Si直接键合界面应力模型,推导出了由于高温引起的正应力、剪切应力和剥离应力的解析方程。
3) silicon on glass
硅/玻璃键合
1.
This paper experimentally studies the effects of the conductivity of a silicon wafer and the gap height between silicon structures and glass substrate on the footing effect for silicon on glass(SOG)structures in the deep reactive ion etching(DRIE)process.
针对反应离子深刻蚀中硅/玻璃键合结构的footing效应问题,用实验方法进行了研究。
4) silicon on glass bonding
硅-玻璃键合
5) glass-silicon bonding
硅∕玻璃键合
6) direct bonding
直接键合
1.
Studies Theoretically and Experimentally on Direct Bonding of Laser Crystals;
激光晶体直接键合理论与实验研究
2.
A bonding rod was compounded with Nd:YAG laser rod and Cr4+:YAG Q-switch by the direct bonding technology.
采用直接键合的方法将Nd:YAG激光棒与Cr4+:YAG调Q元件结合在一起,对Nd:YAG棒和Cr4+:YAG在键合前后的激光性能进行了实验比较。
补充资料：无晶界玻璃相的无压烧结Si_(3)N_(4)材料
无晶界玻璃相的无压烧结Si_(3)N_(4)材料
翼 无晶界玻璃相的无几烧结siN材料
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条