1) silicon-glass thermal bonding (SGTB)
硅-玻璃热键合
1.
To resolve the material thermal mismatch in silicon-glass direct bonding, a method of silicon-glass thermal bonding (SGTB) with SiO2 film assist was proposed.
为了解决Si和普通玻璃进行直接键合时材料的热失配问题,提出了利用SiO2薄膜辅助进行硅-玻璃热键合(SGTB)的技术。
2) silicon on glass
硅/玻璃键合
1.
This paper experimentally studies the effects of the conductivity of a silicon wafer and the gap height between silicon structures and glass substrate on the footing effect for silicon on glass(SOG)structures in the deep reactive ion etching(DRIE)process.
针对反应离子深刻蚀中硅/玻璃键合结构的footing效应问题,用实验方法进行了研究。
3) silicon on glass bonding
硅-玻璃键合
4) glass-silicon bonding
硅∕玻璃键合
5) silicon-glass anodic bonding
硅玻璃阳极键合
6) glass-silicon bonding
玻璃 硅静电键合
补充资料：玻璃退火(见玻璃热处理)
玻璃退火(见玻璃热处理)
annealing of glass
瓣严巍艺棘洪薰l鬓
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条