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1)  ultra-fine-pitch
超细间距
1.
Wire bonding is the most classical and most mature technique for IC interconnection,which takes most of the market share,there are also a lot of research on ultra-fine-pitch wire intercon-nection must to do.
引线键合是应用时间最长、技术最为成熟且目前市场占有率最高的芯片连接技术,但应用于超细间距引线互连还有许多技术有待研究。
2.
So it is a key technology which must be solved in chip miniaturization to study the ultra-fine-pitch wire bonding technology.
随着市场和技术的发展,芯片功能不断增强,引线越来越多,而体积却越来越小,导致焊盘(pad)在整个芯片中所占的面积比不断上升,因此,研究超细间距(ultra-Fine -pitch)键合技术是解决芯片小型化必须解决的一个关键技术。
2)  Extremely fine-pitch
超细节距
3)  super wide clearance
超宽间距
1.
Electrostatic dust precipitator with super wide clearance and long discharging bar and parameter identification;
超宽间距长芒刺电除尘器除尘理论及参数识别
4)  extreme small space
超小间距
1.
Research purposes: Based on the examples,the ideas are expressed on the problems in the design and construction of double vault tunnel and extreme small space tunnel for the purposes of providing reference design of similar tunnels.
研究方法:综合介绍白云山、南京地铁、杭州解放路、小洋山等4座双联拱和超小间距隧道的设计与施工,从而总结概括出此类隧道的若干设计、施工要点。
5)  super-distance space
超距空间
1.
A sufficient and necessary condition in terms of the compactness of super-distance space is given based on the property of super-distance space and the related theory of compactness.
利用超距空间的基本性质及拓扑空间紧致性的相关理论,给出超距空间为紧致空间的充分且必要条件,并讨论了一些相关性质。
2.
By the property of the super-distance space and the connectedness of topological space,we obtained that all of the super-distance space its subspaces and product spaces are neither connected spaces nor arcwise connected space,meanwhile the super-distance space which isn t discrete topological space isn t partially connected space.
利用超距空间的基本性质及拓扑空间的连通理论,得出超距空间及其子空间、积空间既不是连通空间,也不是弧连通空间,而非离散的超距空间不是局部连通空间。
3.
The property of a class of special distance space called super-distance space is studied,including its spherical neighbourhood,cauchy sequence,connectedness,completedness, etc.
研究了一类被称为超距空间的特殊度量空间的性质 ,包括它的球形邻域、cauchy序列、连通性、完备性等性质 。
6)  Fine-pitch
细间距
补充资料:染料细粉及超细粉
分子式:
CAS号:

性质:非水溶性染料或不易溶染料常采用的剂型。如分散染料、还原染料等对粒度及粒度分布均有一定要求,要求相对集中,过细、过粗,均对使用有不良影响。染料生产企业对本企业的产品均作了规定。这些染料产品一般多在2μm到上到4μm范围内,如对某些分散染料要求控制在1μm左右,分散性能4~5级,还原染料也与分散染料近似,故有超细粉之称。为使染料产品达到上述细度,常采用万能粉碎机或砂磨、球磨等进行粉碎。

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