1) fine pitch technology
细间距工艺
2) ultra-fine-pitch
超细间距
1.
Wire bonding is the most classical and most mature technique for IC interconnection,which takes most of the market share,there are also a lot of research on ultra-fine-pitch wire intercon-nection must to do.
引线键合是应用时间最长、技术最为成熟且目前市场占有率最高的芯片连接技术,但应用于超细间距引线互连还有许多技术有待研究。
2.
So it is a key technology which must be solved in chip miniaturization to study the ultra-fine-pitch wire bonding technology.
随着市场和技术的发展,芯片功能不断增强,引线越来越多,而体积却越来越小,导致焊盘(pad)在整个芯片中所占的面积比不断上升,因此,研究超细间距(ultra-Fine -pitch)键合技术是解决芯片小型化必须解决的一个关键技术。
4) interval between cells
细胞间距
6) spinning process
细纱工艺
1.
Optimization of Ramie/Microfibers Polyester Spinning Process;
通过正交试验法 ,重点对纺制苎麻 /细旦涤 (R5 5 /T4 5 ) 9 8tex低特纱的细纱工艺进行了优
补充资料：采气工艺(见天然气开采工艺)
采气工艺(见天然气开采工艺)
gas production technology
，一‘J\匕乙吕天然气开采工艺pro以uetionteehnology)见
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条