1) nexible fine-line
挠性精细线路
2) fine line
精细线路
1.
Degree of Planarization (DOP) together with surface roughness contribute to the feature ofsurface topography, which effected on the fine line especially line/space(L/S) below 50μm.
文章研究了铜表面形貌对HDI精细线路图形转移的影响。
2.
Because of the unavoidable side etching, it is difficult to produce these fine lines by conventional subtractive process.
文章中,介绍以铜箔厚度仅有2μm的溅射型挠性覆铜板为原材料,采用半加成法制作了最小线宽/间距分别为50μm/50μm和30μm/30μm的精细线路基板。
3.
With the development of chip seal technology and the higher request for the fine degree of fineness of plate line,the fine line below 50μm/50μm micron will become the mainstream in the future development.
随着晶片封装技术的不断发展,要求基板线路的精细度越来越高,50μm/50μm以下的COF(Chip on Flex)精细线路将成为未来发展的主流,但精细线路的制作一直是FPC生产上的难点,当线路在50μm/50μm以下时,成品率较低难以满足量产化的要求。
3) fine lines
精细线路
1.
Photoresist: Photoresist resolution decisides the limits the production of fine lines, and is particularly important in fine lines production .
本文主要通过优化片式、RTR和液体光致抗蚀剂对25μm和40μm的COF精细线路进行了研制,对喷墨打印机墨盒用COF挠性印制板生产过程的关键技术做了大量的预研工作,并取得了以下成果:基材方面:材料的稳定性直接影响着COF封装的精确度,本论文通过对基材真空处理然后测量前后的误差来计算COF材料的稳定性。
2.
So it is the hot spot of research that produce COF FPC with right fine lines adapted to the increasing IC density of integration and deceasing I/O spacing.
光致抗蚀剂方面:通过对比杜邦FX900系列两种不同抗蚀层厚度干膜(FX930与FX915)的感光性能、分辨率、附着力、操作工艺等,确定出杜邦FX915(抗蚀层厚度15μm)为更适用于COF挠性印制板制作的干膜;并对干膜的曝光参数进行了优化,最佳曝光级数5级(相对于21级曝光尺),曝光能量片式150mJ/cm~2、卷式110mJ/cm~2,使其更加适合于精细线路的制作。
3.
When producing thinner than 50μm/50μm fine lines according to traditional method, there always are objections of gaps on line or under size lines.
按照片式减成方法制作的线宽/线距在50μm/50μm以下的精细线路,常常会出现导线过细或断线等缺陷。
4) flexible printed wiring
挠性印制线路
5) flexible printed circuit board
挠性印制线路板
1.
Study on hole metallization of flexible printed circuit board
挠性印制线路板孔金属化研究
补充资料：连续性与非连续性(见间断性与不间断性)
连续性与非连续性(见间断性与不间断性)
continuity and discontinuity
11an父ux泊g四f“山。麻以角g、.连续性与非连续性(c。nt，n琳t:nuity一)_见间断性与不间断性。and diseo红ti-
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条