1) ultra-fine-line
超精细电子线路
1.
Therefore, from the printing technologic viewpoint, ink transferring accurately and effectively from the gravure to the substrate is a critical issue for ultra-fine-line electronics applications.
凹版胶印以高分辨率,厚膜层,低方块电阻、工艺简单等特点在众多印刷方式中脱颖而出,被广泛应用于超精细电子线路的生产过程。
2) fine pattern integrated circuit
精细线集成电路
3) fine line
精细线路
1.
Degree of Planarization (DOP) together with surface roughness contribute to the feature ofsurface topography, which effected on the fine line especially line/space(L/S) below 50μm.
文章研究了铜表面形貌对HDI精细线路图形转移的影响。
2.
Because of the unavoidable side etching, it is difficult to produce these fine lines by conventional subtractive process.
文章中,介绍以铜箔厚度仅有2μm的溅射型挠性覆铜板为原材料,采用半加成法制作了最小线宽/间距分别为50μm/50μm和30μm/30μm的精细线路基板。
3.
With the development of chip seal technology and the higher request for the fine degree of fineness of plate line,the fine line below 50μm/50μm micron will become the mainstream in the future development.
随着晶片封装技术的不断发展,要求基板线路的精细度越来越高,50μm/50μm以下的COF(Chip on Flex)精细线路将成为未来发展的主流,但精细线路的制作一直是FPC生产上的难点,当线路在50μm/50μm以下时,成品率较低难以满足量产化的要求。
4) fine lines
精细线路
1.
Photoresist: Photoresist resolution decisides the limits the production of fine lines, and is particularly important in fine lines production .
本文主要通过优化片式、RTR和液体光致抗蚀剂对25μm和40μm的COF精细线路进行了研制,对喷墨打印机墨盒用COF挠性印制板生产过程的关键技术做了大量的预研工作,并取得了以下成果:基材方面:材料的稳定性直接影响着COF封装的精确度,本论文通过对基材真空处理然后测量前后的误差来计算COF材料的稳定性。
2.
So it is the hot spot of research that produce COF FPC with right fine lines adapted to the increasing IC density of integration and deceasing I/O spacing.
光致抗蚀剂方面:通过对比杜邦FX900系列两种不同抗蚀层厚度干膜(FX930与FX915)的感光性能、分辨率、附着力、操作工艺等,确定出杜邦FX915(抗蚀层厚度15μm)为更适用于COF挠性印制板制作的干膜;并对干膜的曝光参数进行了优化,最佳曝光级数5级(相对于21级曝光尺),曝光能量片式150mJ/cm~2、卷式110mJ/cm~2,使其更加适合于精细线路的制作。
3.
When producing thinner than 50μm/50μm fine lines according to traditional method, there always are objections of gaps on line or under size lines.
按照片式减成方法制作的线宽/线距在50μm/50μm以下的精细线路,常常会出现导线过细或断线等缺陷。
5) ultra fine-line
超细线路
1.
This agent could increase copper surface and promote dry film bonding,thus improved ultra fine-line product quality and yields.
这种处理剂以双氧水/硫酸为基础,配以特殊的微观结构调整剂,能在铜面形成均匀粗化的微表面,提高了铜面的表面积,从而促进了干膜与铜面的粘合,提高了超细线路产品的制作良品率。
6) electron nuclear hyperfine coupling
电子核间超精细偶合
补充资料：不精细
1.犹不精明。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条