Therefore, from the printing technologic viewpoint, ink transferring accurately and effectively from the gravure to the substrate is a critical issue for ultra-fine-line electronics applications.

Degree of Planarization (DOP) together with surface roughness contribute to the feature ofsurface topography, which effected on the fine line especially line/space(L/S) below 50μm.

Because of the unavoidable side etching, it is difficult to produce these fine lines by conventional subtractive process.

With the development of chip seal technology and the higher request for the fine degree of fineness of plate line,the fine line below 50μm/50μm micron will become the mainstream in the future development.

Photoresist: Photoresist resolution decisides the limits the production of fine lines, and is particularly important in fine lines production .

So it is the hot spot of research that produce COF FPC with right fine lines adapted to the increasing IC density of integration and deceasing I/O spacing.

When producing thinner than 50μm/50μm fine lines according to traditional method, there always are objections of gaps on line or under size lines.

We presented an optimal algorithm for VLSI L channel routing with crosstalk constraints.

Pre-Evaluation of the Occupational Hazards in Enlarge Construction Project of Microwave Hybrid Integrate Circuit Product Line;