1) backscattered electron
背散射电子
1.
Emission of the backscattered electrons from ultra-thin film on substrate under the action of low-energy beams;
低能束作用下衬底上超薄膜背散射电子发射
2.
Using Monte Carlo method, both emission and spatial distributions of the backscattered electrons(BSEs) of the solids Al,Cu,Ag,Au under the action of low energy electrons with energy E 0≤5*!keV have been simulated and calculated.
应用MonteCarlo方法 ,对能量E0 5keV低能电子作用下固体Al、Cu、Ag、Au的背散射电子发射及表面空间分布作了计算 。
3.
The spatial distribution of backscattered electron in solids have been calculated by Monte Carlo method, based on Mott cross-seCtion for elastic scattering as well as Streitwolf,Quirm and Gryzinski s cross-section for inelastic scattering.
应用ＭｏｎｔｅＣａｒｌｏ方法，对不同能量低能电子作用下背散射电子在固体中的空间分布作了计算，电子的弹性散射用Ｍｏｔｔ截面描述、非弹性散射按文献［３］的方法由Ｓｔｒｅｉｔｗｏｌｆ。
2) EBSD
电子背散射衍射
1.
METALLOGRAPHIC SAMPLE PREPARATION FOR EBSD;
金属电子背散射衍射试样的制备技术
2.
THE APPLICATION OF EBSD IN STEEL AND PIPELINE RESEARCH;
电子背散射衍射分析技术在钢铁及管线钢研究领域中的应用
3.
Electron back scattered diffraction (EBSD) was used to measure the grain size of HPT treated samples.
使用电子背散射衍射技术测量了处理后试样品粒尺寸沿径向的分布。
3) electron back-scatter diffraction
电子背散射衍射
1.
The effect of grain boundary structure on secondary working embrittlement (SWE) of IF steels was studied by electron back-scatter diffraction (EBSD) and TEM.
采用电子背散射衍射(EBSD)技术和 TEM技术对 IF钢二次加工脆性与晶界结构之间的关系进行了研究。
4) Electron backscatter diffraction
电子背散射衍射
1.
A new kind of method for studying critical materials-electron backscatter diffraction (EBSD) analysis technology was introduced.
介绍了一种新型的晶体材料研究方法——电子背散射衍射分析技术。
2.
By using electron backscatter diffraction (EBSD) it is possible to determine microtextures of different types of grains separately.
用电子背散射衍射（ Ｅ Ｂ Ｓ Ｄ）技术可以分别对试样中不同类型的晶粒，测定其显微织构。
3.
This paper describes our preliminary results by using electron backscatter diffraction(EBSD) attachment in a scanning electron microscope.
介绍了用扫描电镜中电子背散射衍射（ＥＢＳＤ）附件所进行的初步研究工作。
5) electron backscatter diffraction
背散射电子衍射
1.
The effect of anodic oxide foil s specific volume by the homemade and the imported Al foil sureface mass,grain size and texture ratio was studied via scanning electron microscope(SEM) and electron backscatter diffraction(EBSD).
采用扫描电子显微镜(SEM)和背散射电子衍射(EBSD)技术分析国产铝光箔与进口铝光箔的表面质量、晶粒大小和织构度对阳极氧化腐蚀箔比容的影响。
6) EBSD
背散射电子衍射
1.
Application of EBSD and TEM techniques in characterization of deformation microstructure of single crystal aluminum;
背散射电子衍射与透射电镜在单晶铝形变组织研究中的应用
2.
The rotations of subgrains around particles in deformed matrices of different rolling orientations and their nucleation at the early stages of recrystallization were studied by means of electron back scattering diffraction (EBSD) technique in an SEM and were compared with those in single crystals of similar orientations.
利用SEM中的背散射电子衍射技术研究了Al—1。
补充资料：背散射电子
分子式：
CAS号：
性质： 高能电子束轰击样品时，从距样品表面0.1～lμm深度范围内散射回来的入射电子。该电子的能量近似入射电子能量。在扫描电镜技术中，高能入射电子束轰击样品表面时，由于电子与物质间的相互作用是一个复杂的过程，故从样品中可激发出各种有用的信息，通过二次电子成像，可以了解样品表面的形貌、受激区域的成分以及有关样品力学、磁学、电子学等性能，其中背散射电子像则着重反映样品的表面形貌和原子序数的分布等。
CAS号：
性质： 高能电子束轰击样品时，从距样品表面0.1～lμm深度范围内散射回来的入射电子。该电子的能量近似入射电子能量。在扫描电镜技术中，高能入射电子束轰击样品表面时，由于电子与物质间的相互作用是一个复杂的过程，故从样品中可激发出各种有用的信息，通过二次电子成像，可以了解样品表面的形貌、受激区域的成分以及有关样品力学、磁学、电子学等性能，其中背散射电子像则着重反映样品的表面形貌和原子序数的分布等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条