1) electron back-scattering patterns(EBSP)
电子背散射衍射分析(EBSP)
2) Electron Backscatter Pattern (EBSP)
电子背散射衍射花样(EBSP)
3) back scattering electron(BSE) analysis
背散射电子分析
4) EBSD
电子背散射衍射
1.
METALLOGRAPHIC SAMPLE PREPARATION FOR EBSD;
金属电子背散射衍射试样的制备技术
2.
THE APPLICATION OF EBSD IN STEEL AND PIPELINE RESEARCH;
电子背散射衍射分析技术在钢铁及管线钢研究领域中的应用
3.
Electron back scattered diffraction (EBSD) was used to measure the grain size of HPT treated samples.
使用电子背散射衍射技术测量了处理后试样品粒尺寸沿径向的分布。
5) electron back-scatter diffraction
电子背散射衍射
1.
The effect of grain boundary structure on secondary working embrittlement (SWE) of IF steels was studied by electron back-scatter diffraction (EBSD) and TEM.
采用电子背散射衍射(EBSD)技术和 TEM技术对 IF钢二次加工脆性与晶界结构之间的关系进行了研究。
6) Electron backscatter diffraction
电子背散射衍射
1.
A new kind of method for studying critical materials-electron backscatter diffraction (EBSD) analysis technology was introduced.
介绍了一种新型的晶体材料研究方法——电子背散射衍射分析技术。
2.
By using electron backscatter diffraction (EBSD) it is possible to determine microtextures of different types of grains separately.
用电子背散射衍射( E B S D)技术可以分别对试样中不同类型的晶粒,测定其显微织构。
3.
This paper describes our preliminary results by using electron backscatter diffraction(EBSD) attachment in a scanning electron microscope.
介绍了用扫描电镜中电子背散射衍射(EBSD)附件所进行的初步研究工作。
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