The relative motion law of the particles in slurry, with respect to the processed surface of the silicon, during the chemical mechanical planarization (CMP) of microelectronic materials is firstly discussed.

The deformation of materials and material removal mechanism during chemical mechanical palnarization (CMP) processing of microelectronic materials are numerically analyzed using finite element method.

With the scaling down of device feature size in integrated circuits (IC), it becomes apparent that the mechanical properties of micro-nanoelectronics materials exert increasingly important impact on the reliability of devices, even to that of the entire circuit.

Applications of copper plating technology to electronic materials;

This paper reviews the development from the electronic materials to the optolectromc and photonic materials with respect to the progress of information technology (IT).

They are modern analysis instrument and technology,electronic materials and devices,and thin film physics and technology.

Since the current voltage characteristics of the threshold memory switch in chalcogenides have been observed by Ovshinsky at 1968, especially both n type and p type doping for hydrogenated amorphous silicon have been avaliable, as one kind of important electronic materials amorphous semiconductors in both fundamental research and application were remarkably developed over the past 30 years.