1) Cr-Si-N coating
Cr-Si-N薄膜
1.
Cr-Si-N coatings by incorporating several atomic percentage of Si to CrN were prepared,using an arc ion plating method.
利用电弧离子镀方法,在(SCM415)钢基体上制备了Cr-Si-N薄膜。
2) Cr-Si-C-N film
Cr-Si-C-N薄膜
1.
In this paper,Cr-Si-C -N films were prepared by cathode arc ion deposition technique,in which tetramethylsilane(TMS) was used as Si and C sources,and their concentrations in the Cr-Si-C-N films can be controlled by TMS flow.
采用电弧离子反应沉积技术在SCM415渗碳淬火钢基片上沉积了Cr-Si-C-N薄膜,三甲基硅烷(TMS)反应气体作为Si和C掺杂源,通过改变TMS流量实现了薄膜中Si和C含量的调节。
3) Cr-N film
Cr-N薄膜
1.
Study of the oxidation resistance of Cr-N film;
Cr-N薄膜抗氧化性能的研究
2.
Cr-N films are deposited in this equipment, the influences of deposition parameters on the structure and properties of the films are analyzed, such as the ratio of gas (N2 and Ar),.
分析结果表明,Cr-N薄膜显著提高了基体的显微硬度和耐磨性,Cr-N薄膜硬度是基底硬度的4-8倍。
4) SmCo(Al,Si) thin film
SmCo(Al,Si)/Cr薄膜
5) C-N-Cr film
C-N-Cr薄膜
1.
In this paper,the uniform,smooth and dense C-N-Cr films with different compositions were deposited on cemented carbide substrate at different nitrogen flow rates by pulsed bias arc ion plating.
用脉冲偏压电弧离子镀设备在保持偏压一致和工作气压恒定的条件下,控制不同氮(N)流量,在硬质合金基体上制备了不同成分的C-N-Cr薄膜。
6) Ti-Si-N films
Ti-Si-N薄膜
1.
The influence of bombardment energy on the growth and mechanical property is investigated,and the influence of bombardment energy on the growth mechanism of Ti-Si-N films is discussed.
试验结果表明:当轰击能量为700eV时,Ti-Si-N薄膜晶粒直径达到了最小值11nm,此时Ti-Si-N薄膜的硬度相对最高,为33GPa。
补充资料：Cr-Si thin film resistor
分子式：
CAS号：
性质：以铬和硅为主成分的薄膜高阻材料。具有电阻率高、稳定性好、电阻温度系数小等特点。控制硅化物结构，可得到各种电性能材料。如随铬增加，电阻率下降，电阻温度系数可从负数逐渐变到正值，一般方阻3～5kΩ，电阻温度系数(100～150)×10-6/℃。采用溅射、电子束蒸发、真空蒸镀等方法制取，主要用于制作薄膜混合集成电路中的薄膜电阻器。
CAS号：
性质：以铬和硅为主成分的薄膜高阻材料。具有电阻率高、稳定性好、电阻温度系数小等特点。控制硅化物结构，可得到各种电性能材料。如随铬增加，电阻率下降，电阻温度系数可从负数逐渐变到正值，一般方阻3～5kΩ，电阻温度系数(100～150)×10-6/℃。采用溅射、电子束蒸发、真空蒸镀等方法制取，主要用于制作薄膜混合集成电路中的薄膜电阻器。
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参考词条