2) wire bonding
引线键合
1.
Studies on the Characteristic of Ultrasonic Complex Transverse Vibration Energy Transmission in Wire Bonding;
引线键合中多向超声能量传输特性研究
2.
Automatic wire bonding system for MEMS sensor packaging;
MEMS器件自动引线键合系统
3.
A novel instrument of silicon chip thermocompression outer wire bonding and jointing process research;
硅芯片外引线键合的热压焊装置及焊接工艺
3) Bonding Wire
键合引线
4) bond strength
键合强度
1.
So the effects of the capillary motion on interfacial deformation and bond strength were described accurately.
通过引入键合界面单元变形量、接触率等参量,得出劈刀运动历程对键合界面变形的影响规律,进而也揭示了其对键合强度的影响。
2.
During the bonding process of Au wire thermosonic bonding,the result of the bond strength was according with the technology require.
文章分析了一例采用金丝热超声键合电路在工艺监控过程中的键合强度检测合格,在高温稳定性烘焙后其引线抗拉强度同样符合MIL-STD-883G方法2011。
3.
The bond strength of PMMA was measured by MTS-809 system.
研究了PMMA热压键合工艺,测量了PMMA的键合强度,利用扫描电镜检测了键合后微流体管道的结构变化,讨论了键合温度、键合压力等因素对键合强度的影响;给出了热压键合的合理工艺参数范围。
5) Bonding strength
键合强度
1.
Anodic bonding strength and its evaluation;
阳极键合强度及其评价方法
2.
Effect of bonding time on thick aluminum wire wedge bonding strength;
键合时间对粗铝丝超声引线键合强度的影响
3.
A Study on Bonding Strength of Hybrid Integrated Circuits;
功率混合集成电路键合强度控制研究
补充资料：表光合强度(见光合强度)
表光合强度(见光合强度)
forecast of sowing or transplanting time
b iaoguanghe qiangdu表光合强度见光合强度
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条