1.
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响
2.
On-Line Examination Method of Bonding Strength Measurement in Silicon MEMS Devices
硅MEMS器件键合强度在线检测方法
3.
Investigation of Factors Affecting Bonded Ball Hardness on Copper Wire Bonding
铜引线键合中影响焊球硬度因素的研究(英文)
4.
Research on the Factors Affecting the First Bond of Ultra-Fine Pitch Wire Bonding Process;
超细间距引线键合第一键合点影响因素研究
5.
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究
6.
Bond strength is an important parameter for wafer bond.
键合强度是关系到键合好坏的一个重要参数。
7.
Influence of Silicon/Glass-ceramic Anodic Bonding Technology on Bonding Intensity
硅/微晶玻璃阳极键合工艺对键合强度的影响
8.
Research on High Strength and High Conductivity Copper Alloys for Lead Frame Used in Large Scale Integrated Circuit;
大规模集成电路用高强度高导电引线框架铜合金研究
9.
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
10.
Research on Micro Vision System for Automatic MEMS Wire Bonding;
面向MEMS自动引线键合的显微视觉系统研究
11.
The Research of the Image Recognition System for Intelligent IC Wire Bonder;
智能IC引线键合机图像识别系统的研究
12.
Research of Methods for Bonds Inspection of Automatic Wire Bonder;
全自动引线键合机产品检测方法的研究
13.
Software Analysis and Design of the Fully Automatic Gold Wire Bonder
全自动引线键合机系统软件分析与设计
14.
Implementation and Reliability of Wire-Bonding for 3-D Packages
三维封装中引线键合技术的实现与可靠性
15.
Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System
超声振动在引线键合系统中的传播仿真与研究
16.
Application of Novel Image Matching Algorithm in Golden Wire Bonder
新图像匹配算法在金丝球引线键合机中的应用
17.
The Design of Holding Feed Mechanism of the Die Bonder
键合机引线框架夹持传送机构的设计与开发
18.
Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit
微波电路引线键合质量的影响因素分析