1.
The Research of the Image Recognition System for Intelligent IC Wire Bonder;
智能IC引线键合机图像识别系统的研究
2.
Research on the Factors Affecting the First Bond of Ultra-Fine Pitch Wire Bonding Process;
超细间距引线键合第一键合点影响因素研究
3.
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究
4.
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
5.
Research on Micro Vision System for Automatic MEMS Wire Bonding;
面向MEMS自动引线键合的显微视觉系统研究
6.
Research of Methods for Bonds Inspection of Automatic Wire Bonder;
全自动引线键合机产品检测方法的研究
7.
Software Analysis and Design of the Fully Automatic Gold Wire Bonder
全自动引线键合机系统软件分析与设计
8.
Investigation of Factors Affecting Bonded Ball Hardness on Copper Wire Bonding
铜引线键合中影响焊球硬度因素的研究(英文)
9.
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响
10.
Implementation and Reliability of Wire-Bonding for 3-D Packages
三维封装中引线键合技术的实现与可靠性
11.
Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System
超声振动在引线键合系统中的传播仿真与研究
12.
Application of Novel Image Matching Algorithm in Golden Wire Bonder
新图像匹配算法在金丝球引线键合机中的应用
13.
The Design of Holding Feed Mechanism of the Die Bonder
键合机引线框架夹持传送机构的设计与开发
14.
Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit
微波电路引线键合质量的影响因素分析
15.
Analysis of Impact Factors on the Bonding Quality of Gold Ball Bonding Process;
面向引线键合工艺的质量影响因素与规律的分析
16.
Vision-Based Kinematic Calibration of the X-Y Table for a Wire Bonder
基于计算机视觉的引线键合机定位平台的运动学标定
17.
Clutch Coil Lead Wire Harness
离合器线圈引导线束
18.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素