1) plastic package
塑料封装
1.
The finite element analysis on moisture diffusion in microelectronic plastic packages during moisture preconditioning by using a commercial FEA software is studied and modeled.
塑料封装器件暴露在一定的潮湿环境下将会吸收潮湿的现象已经得到广泛的认同。
2.
A new kind of pulse laser on tunnel junction with plastic package is reported.
报道了一种新型塑料封装隧道结脉冲半导体激光器。
2) plastic capsulation
塑料封装
1.
In the paper,resin material,the transfer molding mechanism,craft process and control as well as the mold of plastic capsulation of microelectronic components are analyzed and researched.
对微电子塑料封装所用树脂材料、树脂的传递、模塑成型机理、工艺过程及控制、塑料封装所采用的模具作了分析研究,将封装材料、工艺过程和模具设计三者紧密联系起来,为微电子塑料封装相关企业提供一个合理的参考依据。
3) plastic electronic packaging
微电子塑料封装
1.
The polymers commonly used in plastic electronic packaging are apt to absorb moisture in the environment, which greatly affects the reliability of packages.
微电子塑料封装中常用的聚合物材料因易于吸收周围环境中的湿气而对器件本身的可靠性带来很大影响,本文回顾了封装材料中湿气扩散、湿应力及蒸汽压力的产生这3个互相联系过程的研究情况,从理论分析、特征参数描述及其实验测定、有限元模拟分析的角度来分别予以介绍。
4) plastic device
塑料封装器件
6) plastic flat package (PFP)
塑料扁平封装
补充资料：环氧塑料封装产品
环氧塑料封装产品
翻坛刁 获魏簇蕊}产吧竺i环‘塑\
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条