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1)  single layer of polyamideimide
聚酰胺酰亚胺单涂层
2)  polyimide coatings
聚酰亚胺涂层胶
3)  polyimide coated optical fiber
聚酰亚胺涂层光纤
4)  Polyimide [英][,pɔli'imaid]  [美][,pɑli'ɪm,aɪd]
聚酰亚胺
1.
Synthesis and properties of sulfonyl-substituted polyimides with high refractive indices and high transparency;
砜基取代高折射率高透明性聚酰亚胺的合成与性能
2.
Study on polyimide resin modified by nano-Si_3N_4 for diamond tools;
金刚石磨具纳米Si_3N_4改性聚酰亚胺树脂结合剂研究
3.
Effect of coupling agent on microstructure and properties of polyimide/SiO_2 hybrid membrane;
偶联剂对聚酰亚胺/SiO_2杂化膜性能的影响
5)  PI [英][pai]  [美][paɪ]
聚酰亚胺
1.
Stability of Nanoparticles in PI-Inorganic Hybrid Films;
无机纳米杂化聚酰亚胺薄膜纳米颗粒特性研究
2.
Development of advanced composite materials PI;
聚酰亚胺先进复合材料的研究进展
3.
The Experiment of Observing PI Damage Causing by Static Electricity;
液晶盒中聚酰亚胺静电击伤的观测实验
6)  Polyimide(PI)
聚酰亚胺
1.
Polyimide(PI) film etched by electron beam(EB) to produce PI micron-hole separation membrane combined with the methods of masks and oxygenation corrosion was studied in this paper.
以电子束蚀刻技术,结合微孔掩膜和溶液氧化腐蚀的方法,制备聚酰亚胺(Polyimide,PI)微孔分离膜。
2.
Using TG-DTG,DSC and IR techniques,the non-isothermal decomposition kinetics of a new polyimide(PI) which is synthesized by 3,3′,4,4′-benzophenone tetracarboxylic dianhydride(BTDA) and 4,4′-(1,3-phenylenedioxy)-dianiline(CAS: 2479-461),were studied.
通过热重法、差示量热扫描法以及红外光谱法研究了由3,3,′4,4-′benzophenone tetracarboxy licd ianhydride(二苯酮四酸二酐,简称BTDA)和4,4-(′1,3-pheny lened ioxy)-d ian iline(CA S:2479-461)所形成的一种新型聚酰亚胺的非等温热分解过程,测得其失重5%温度为492℃,失重10%温度为530℃。
3.
As a kind of polymer material, polyimide(PI) holds a favorable complanation property and is easy to become ash in the oxygen.
聚酰亚胺树脂(PI)因其良好的平面化特性、在氧气中易灰化、不完全固化易溶解于碱性显影液、在CHF3等离子气氛中有较强的抗蚀性等性质,在电容RFMEMS开关的制作过程中,应用它作为刻蚀保护层和牺牲层,不但可以使工艺过程得到简化,而且可以对开关的介质层尺寸、牺牲层厚度等图形参数起到很好的控制作用。
补充资料:聚酰胺-酰亚胺纤维
分子式:
CAS号:

性质:指含芳酰胺-酰亚胺链节的纤维。强度1.5~3.5cN/dtex,伸长率23%~32%,模量24~49cN/dtex,密度1.34g/cm3,吸湿率3.5%,在200℃的收缩率为0%~0.5%,极限氧指数30~32。制法是将二亚苯基甲烷二异氰酸酯和1,2,4-偏苯三酸酐在N-甲基吡咯烷酮中溶液缩聚和湿纺而得。用途有消防服、军服、赛车服、石化工作服、与黏胶、羊毛或芳纶的混纺织物、无纺织物、地毯、地板革、纸增强材料、滤材、电绝缘材料。

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