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1)  polyamide-imide
聚酰胺酰亚胺
1.
Preparation and application of polyamide-imide;
聚酰胺酰亚胺的制备及其应用
2.
Polyamide acid was synthesized by polycondensation of trimellitic anhydride chloride(TMAC) and 4,4′-diaminodiphenylether(DDE) in N,N-dimethylacetamide(DMAC),and then coverted into polyamide-imide by treating with acetic anhydride and triethlamine mixture.
以合成的高纯度偏苯三酸酐酰氯(TMAC)和4,4′-二氨基二苯醚为原料,N,N-二甲基乙酰胺为溶剂,制备聚酰胺酸预聚体,再用醋酐和三乙胺将其亚胺化得到聚酰胺酰亚胺(PAI),考察了聚合反应条件对分子量的影响,用FT-IR1、H-NMR表征了PAI的结构,并采用热失重(TGA)和差动扫描量热分析仪(DSC)对PAI进行热性能研究。
3.
Heat-resistant self-bonding polyamide-imide varnish for magnet wire is formulated with trimellitic anhydride and diisocyanate as raw materials, N-methylpyrrilidone as solvent by controlling reaction temperature, reaction time, reaction progress and polymerization degree, and adding different additive agents.
以偏苯三酸酐和二苯基甲烷二异氰酸酯为原料,N-甲基吡咯烷酮为溶剂,控制反应温度、时间、反应进程、聚合度,适时添加各种助剂,制备性能优良的耐高温聚酰胺酰亚胺自粘电磁线漆。
2)  Polyamide imide
聚酰胺酰亚胺
1.
A polyamide imide was synthesized from trimelltic anhydride and di isocyanate.
本文用偏苯三酸酐和二异氰酸酯合成了一种新型聚酰胺酰亚胺
3)  poly(amide-imide)
聚酰胺酰亚胺
1.
A series of poly(amide-imide)s(PAIs) were prepared from the diacid and various aromatic diamines via Yamazaki-Higashi reaction in N-methyl-2pyrrolidone,with triphenyl phosphite and pyridine as condensing agents,and calcium chloride as catalyst.
以此两种酸为原料、N-甲基-2-吡咯烷酮(NMP)为溶剂、亚磷酸三苯酯(TPP)与吡啶为缩合剂、氯化钙为催化剂,通过Yamazaki-Higashi反应,直接与3种芳香族二胺单体反应制得一系列聚酰胺酰亚胺(PAI)。
4)  Polyimide [英][,pɔli'imaid]  [美][,pɑli'ɪm,aɪd]
聚酰亚胺
1.
Synthesis and properties of sulfonyl-substituted polyimides with high refractive indices and high transparency;
砜基取代高折射率高透明性聚酰亚胺的合成与性能
2.
Study on polyimide resin modified by nano-Si_3N_4 for diamond tools;
金刚石磨具纳米Si_3N_4改性聚酰亚胺树脂结合剂研究
3.
Effect of coupling agent on microstructure and properties of polyimide/SiO_2 hybrid membrane;
偶联剂对聚酰亚胺/SiO_2杂化膜性能的影响
5)  PI [英][pai]  [美][paɪ]
聚酰亚胺
1.
Stability of Nanoparticles in PI-Inorganic Hybrid Films;
无机纳米杂化聚酰亚胺薄膜纳米颗粒特性研究
2.
Development of advanced composite materials PI;
聚酰亚胺先进复合材料的研究进展
3.
The Experiment of Observing PI Damage Causing by Static Electricity;
液晶盒中聚酰亚胺静电击伤的观测实验
6)  Polyimide(PI)
聚酰亚胺
1.
Polyimide(PI) film etched by electron beam(EB) to produce PI micron-hole separation membrane combined with the methods of masks and oxygenation corrosion was studied in this paper.
以电子束蚀刻技术,结合微孔掩膜和溶液氧化腐蚀的方法,制备聚酰亚胺(Polyimide,PI)微孔分离膜。
2.
Using TG-DTG,DSC and IR techniques,the non-isothermal decomposition kinetics of a new polyimide(PI) which is synthesized by 3,3′,4,4′-benzophenone tetracarboxylic dianhydride(BTDA) and 4,4′-(1,3-phenylenedioxy)-dianiline(CAS: 2479-461),were studied.
通过热重法、差示量热扫描法以及红外光谱法研究了由3,3,′4,4-′benzophenone tetracarboxy licd ianhydride(二苯酮四酸二酐,简称BTDA)和4,4-(′1,3-pheny lened ioxy)-d ian iline(CA S:2479-461)所形成的一种新型聚酰亚胺的非等温热分解过程,测得其失重5%温度为492℃,失重10%温度为530℃。
3.
As a kind of polymer material, polyimide(PI) holds a favorable complanation property and is easy to become ash in the oxygen.
聚酰亚胺树脂(PI)因其良好的平面化特性、在氧气中易灰化、不完全固化易溶解于碱性显影液、在CHF3等离子气氛中有较强的抗蚀性等性质,在电容RFMEMS开关的制作过程中,应用它作为刻蚀保护层和牺牲层,不但可以使工艺过程得到简化,而且可以对开关的介质层尺寸、牺牲层厚度等图形参数起到很好的控制作用。
补充资料:聚酰胺酰亚胺
分子式:
CAS号:

性质:酰亚胺环和酰胺键有规则交替排列的一类聚合物。由4,4′-二氨基联苯醚和1,2,4-偏苯三甲酸酐酰氯在极性溶剂二甲基乙酰胺中进行缩合反应,制成聚酰胺亚胺酸,然后在高温下闭环生成不溶不熔高聚物。主要产品包括层压复合材料、薄膜、浸渍漆、漆包线漆、黏合剂等。玻璃化温度250~300℃,250℃下具有优越的机械性能,热变形温度为269℃,模塑料拉伸强度为90MPa(23℃)和59MPa(260℃),弯曲强度为157MPa(23℃)和96MPa(260℃)。使用温度从低温(-195℃)到230℃、尺寸稳定性和抗蠕变性优良,耐腐蚀、耐辐照,但在潮湿环境中吸湿。经环氧树脂改性降低成型温度、获实际应用。液晶聚酰胺酰亚胺经液晶相增强,力学强度进一步提高。具有价格较低、耐磨耐碱性好、黏结力和贮存稳定性好等优点,适于作耐热漆包线漆及玻璃层压板黏合漆,也可作为高温黏合剂。在实际使用时,可先制成聚酰胺亚胺酸预聚物,涂装施工后在高温下闭环成膜;也可在水中沉淀,水洗除酸,干燥,制成树脂粉末,临用前以二甲基乙酰胺等极性溶剂溶解,调至适当黏度即可使用。

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