1) copper-based catalyst
铜基触媒
2) copper-based
铜基
1.
Research progress of self-lubricating copper-based composite materials by electrodeposition;
电沉积铜基自润滑复合材料的研究进展
2.
Wet friction properties of copper-based material via powder metallurgy;
铜基粉末冶金摩擦材料的湿式摩擦性能
3.
The effects of alloy elements(Zn、Ni) on the properties of copper-based brake materials were investigated.
通过对比研究了合金元素锌和镍对铜基粉末冶金刹车材料性能的影响规律。
3) copper matrix
铜基
1.
To improve the intensity and electrical conductivity of copper matrix composite,nano ZrO_2 stabilized with 3mol% Y_2O_3 was selected as the reinforcement,which had good mechanical and thermal physical performance.
为了提高铜基复合材料的强度和电导率,采用具有良好机械性能和热物理性能的ZrO2(3%(摩尔分数)Y2O3)作为增强相,原位化学法制备了ZrO2纳米颗粒增强铜基复合材料,其主要制备工艺包括前驱复合粉体CuO、ZrO2的制备,经氢气还原得到ZrO2/Cu复合粉,再经过压制,真空烧结,复压等工序制得最后的样品。
2.
To improve the intensity and conductivity of the copper matrix composite, ZrO_2(3Y) as the reinforcement because of the good mechanical and physical performance, ZrO_2/Cu nanocomposite was fabricated by in-situ chemical routine.
为了提高铜基复合材料的强度和电导率,采用具有良好机械性能和热物理性能的ZrO_2(3mol%Y_2O_3)作为增强相,原位化学法制备了ZrO_2纳米颗粒增强铜基复合材料,其主要制备工艺包括前驱复合粉体CuO,ZrO_2的制备,经氢气还原得到ZrO_2/Cu复合粉,再经过压制,真空烧结,复压等工序制得最后的样品。
4) copper based
铜基
1.
The paper studies on the prescription and preparationcondition of the copper based shift reaction catalyst detailedly from nantokite and mangante as the resource.
以铜盐、锰盐为原料,详细研究了铜基低水碳比型CO高温变换催化剂的配方及制备工艺条件。
5) copper substrate
铜基
1.
Preliminary investigation of electroless tin plating on copper substrate;
铜基上化学镀锡新工艺初探
2.
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
6) Cu-matrix
铜基
1.
The interfacial combination of Gr and Cu-matrix were systematically studied.
本文选用镀铜、镀镍石墨粉，采用粉末冶金工艺制备出铜基石墨自润滑材料。
参考词条
补充资料：触媒
分子式：
分子量：
CAS号：
性质：见催化剂。
分子量：
CAS号：
性质：见催化剂。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。