1.
Application of Sn-Ni Alloy Electroplating on Fabric
电镀Sn-Ni合金在织物上的应用
2.
Study on Electroplating Ni-Sn-P Alloy Coating and Composite Coating
电镀Ni-Sn-P合金及其复合镀层的研究
3.
Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy plating
Sn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
4.
Study on Electroless Plating Ni-Sn-P Alloy Coating and Composite Coating;
化学镀Ni-Sn-P合金及其复合镀层的研究
5.
Effect of Sn(Ⅳ) on Corrosion Resistance of Tin Coatings in PSA Tin Plating Bath
PSA镀锡液中Sn(Ⅳ)含量对镀层耐蚀性的影响
6.
Study on Processes and Performances of Electroless Composite Plating(Ni-Sn-P)-Si_3N_4 Coating
复合化学镀(Ni-Sn-P)-Si_3N_4镀层及其性能研究
7.
The Study of Pulse Electroplating of Au-Sn Bumps
脉冲电镀法制备Au-Sn凸点的研究
8.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
9.
Welding failure analysis of tin coating for the terminal electrode of MLCC
MLCC端电极Sn镀层的焊接失效分析
10.
The Study of Sequential Electroplating Au/Sn Bumps for FC-LEDs;
分步电镀法制备FC-LEDs用Au/Sn凸点的研究
11.
Preparation and Property of Cu-Sn-P-ZrO_2 Electroless Nanometer Composite Coating;
纳米复合材料镀层Cu-Sn-P-ZrO_2的制备和性质研究
12.
Investigation on Electrodeposition of Bronze-PTFE Composite Coatings on Stainless Steel Substrate
不锈钢基体电沉积Cu-Sn-PTFE复合镀层的研究
13.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
14.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
15.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
16.
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
17.
There is approximately 1.5 times more oleic in the sn - 1 than in the sn - 2position.
位于sn-1位的油酸约比sn-2位的多1.5倍。
18.
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响