1.
Welding failure analysis of tin coating for the terminal electrode of MLCC
MLCC端电极Sn镀层的焊接失效分析
2.
Study on Electroplating Ni-Sn-P Alloy Coating and Composite Coating
电镀Ni-Sn-P合金及其复合镀层的研究
3.
Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy plating
Sn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
4.
Study on Electroless Plating Ni-Sn-P Alloy Coating and Composite Coating;
化学镀Ni-Sn-P合金及其复合镀层的研究
5.
Effect of Sn(Ⅳ) on Corrosion Resistance of Tin Coatings in PSA Tin Plating Bath
PSA镀锡液中Sn(Ⅳ)含量对镀层耐蚀性的影响
6.
Study on Processes and Performances of Electroless Composite Plating(Ni-Sn-P)-Si_3N_4 Coating
复合化学镀(Ni-Sn-P)-Si_3N_4镀层及其性能研究
7.
Preparation and Property of Cu-Sn-P-ZrO_2 Electroless Nanometer Composite Coating;
纳米复合材料镀层Cu-Sn-P-ZrO_2的制备和性质研究
8.
Investigation on Electrodeposition of Bronze-PTFE Composite Coatings on Stainless Steel Substrate
不锈钢基体电沉积Cu-Sn-PTFE复合镀层的研究
9.
The Study of Pulse Electroplating of Au-Sn Bumps
脉冲电镀法制备Au-Sn凸点的研究
10.
Application of Sn-Ni Alloy Electroplating on Fabric
电镀Sn-Ni合金在织物上的应用
11.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
12.
The Study of Sequential Electroplating Au/Sn Bumps for FC-LEDs;
分步电镀法制备FC-LEDs用Au/Sn凸点的研究
13.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
14.
Plating Technology and Properties of Electroless Ni-Mo-P Alloy Coatings
化学镀Ni-Mo-P合金镀工艺及镀层性能
15.
Mass Calculation of coating (For equal coating)/MM
锌镀层质量(两个相同锌镀层厚度)
16.
The adhesive strength of the acid film was stronger than that of the alkali film.
碱性镀层的结合强度优越于酸性镀层。
17.
Research of Ni-P Gradient Coating and Ni-P/SiC Gradient Coating;
Ni-P梯度镀层及Ni-P/SiC梯度镀层研究
18.
Preparation and Characterization of Silver Coating and Silver-based Composite Coating
银镀层及银基复合镀层的制备与表征