1)  solder ball
钎料球
1.
In this paper,temperature distribution of PBGA component during laser reflow process of solder ball was simulated with finite element method,and effects of different heating means of laser on temperature distribution were discussed in detail.
对PBGA封装制造时钎料球的激光重熔过程中的温度场分布进行了数值模拟 ,考察了多点和扫描两种激光加热方式对温度场的影响。
2)  Micro solder ball bonding
微钎料球键合
3)  brazing alloy
钎料
1.
Properties and welding interface characterization of new-type Au-Ag-Ge brazing alloy;
新型Au-Ag-Ge钎料的性能及焊接界面特征
2.
The results indicate that the base metal, 60wt%BNi2+40wt%BNi5 brazing alloy and BNi2 brazing alloy is with similar passivation current, but the initial passivation potential is increased in turn, which demonstrates that their corrosion resistance is decreased in the same sequence.
通过电化学方法研究了钎料分别为60%BNi2+40%BNi5(质量分数)和BNi2的316L不锈钢钎焊接头在人造海水中的耐腐蚀性能。
4)  filler metal
钎料
1.
The vacuum brazing process of 5CrMnMo steel and YG8 hard metal were studied by using CuMnNi filler metal.
选用CuMnNi钎料,研究了5CrMnMo钢与YG8硬质合金的真空钎焊工艺。
2.
The filler metals and fluxes suitabled for 2A50 aluminum alloy brazing were selected according to the feature of 2A50 aluminum alloy and the test of spreadability and clearance fillabitity.
针对2A50铝合金的特点,根据铺展性、填缝性试验,对适合其钎焊的钎料与钎剂作了选择,进行了接头强度试验。
5)  brazing filler metal
钎料
1.
Wettability of two kinds of Pd-Ni brazing filler metals on Si_3N_4 ceramic;
两种Pd-Ni基高温钎料在Si_3N_4陶瓷上的润湿性
2.
Wettability of Au-Ag-Si brazing filler metal series with Ni;
Au-Ag-Si系钎料合金与Ni的润湿性
3.
The vacuum brazing of 40Cr steel to hard alloy YG8 with CuMnNi brazing filler metal is investigated.
选用CuMnNi钎料,对40Cr钢与YG8硬质合金进行真空钎焊试验,研究钎焊温度和Ni中间层对钎焊接头性能的影响,并用三点弯曲试验确定最佳工艺参数;通过使用扫描电镜观察显微组织及能谱分析钎料中各元素在母材中的扩散情况,并结合钎料在40Cr钢和YG8硬质合金上铺展的润湿角的比较,探讨了该钎料与母材的结合性能。
6)  solder
钎料
1.
Development of solders for aluminum brazing;
铝合金钎焊用钎料的发展动态
2.
Effect of adding Bi element on Sn3.5Ag eutectic alloy solder;
Bi对Sn3.5Ag共晶合金钎料性能的影响
3.
Properties and interface microstructure of new type Ag-Cu-Ge solder;
新型Ag-Cu-Ge钎料的性能及钎焊界面特征
参考词条
补充资料:料球
1.指清朝官员帽顶上所缀的料质圆球。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。