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1)  SnAgCu solder
SnAgCu钎料
1.
In situ observation and research on electrochemical migration of SnAgCu solder joints;
SnAgCu钎料焊点电化学迁移的原位观察和研究
2.
Effect of rare earths elements on properties of SnAgCu solder alloy
稀土元素对SnAgCu钎料性能的影响
2)  SnAgCu lead-free solder
SnAgCu无铅钎料
3)  SnAgCu solder alloy
SnAgCu钎料合金
4)  SnAgCu solder
SnAgCu焊料
1.
Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate
微量Ce对SnAgCu焊料与铜基界面IMC的影响
5)  Lead-free material (SnAgCu)
无铅材料(SnAgCu)
6)  brazing alloy
钎料
1.
Properties and welding interface characterization of new-type Au-Ag-Ge brazing alloy;
新型Au-Ag-Ge钎料的性能及焊接界面特征
2.
The results indicate that the base metal, 60wt%BNi2+40wt%BNi5 brazing alloy and BNi2 brazing alloy is with similar passivation current, but the initial passivation potential is increased in turn, which demonstrates that their corrosion resistance is decreased in the same sequence.
通过电化学方法研究了钎料分别为60%BNi2+40%BNi5(质量分数)和BNi2的316L不锈钢钎焊接头在人造海水中的耐腐蚀性能。
补充资料:钎料
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性质:为实现两种材料(或零件)的结合,在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料(熔点低于450℃的钎料),硬钎料(熔点高于450℃的钎料)。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。

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