1) as-deposited
溅射态
2) sputtering
溅射
1.
XPS study of Ni_(49.54)Mn_(29.59)Ga_(20.87) magnetically driven shape memory alloy thin film fabricated by D.C magnetron sputtering technique;
直流磁控溅射Ni_(49.54)Mn_(29.59)Ga_(20.87)磁驱动记忆合金薄膜的XPS研究
2.
Growth and characterization of aluminum nitride films by penning-type discharge plasma sputtering process;
潘宁放电溅射沉积纳米级AlN薄膜的性质
3.
Growth of TiN Film by Modified Ion Beam Enhanced Magnetron Sputtering;
气离溅射离子镀制氮化钛
3) Sputtered
溅射
1.
In order to improve appearance and hydrophobicity of waterproof and moisture permeable coatings, the yellowish of sputtered polymeric fluorocarbon films was investigated.
为改善射频溅射法制备的防水透湿涂层的外观和拒水性 ,对涤纶织物基底上的溅射氟碳高分子膜的泛黄问题进行了研究。
2.
By means of the Monte-Carlo simulation based on the binding collision approximation,this paper investigates the sputtering of Silver and Cadmium element targets bombarded by 27 keV Ar+ ions and studies the spatial distribution of sputtered atoms by collision cascade.
用蒙特卡罗方法模拟能量为２７ｋｅＶＡｒ＋轰击Ａｇ和Ｃｄ单元素靶的力学运动，以研究级联碰撞产生的溅射原子的空间分布情况，对计算结果进行适当的数学处理，以得出微分溅射产额角分布。
3.
The XRD patterns of SnO2 thin film sputtered with different methods are compare 1 for their difference in the field of structure.
本文采用三种不同的溅射方法制备具有纳米尺度的SnO2薄膜,针对溅射方式的不同,结合薄膜结构上的差异,对三种溅射方式制备的SnO2薄膜进行了XRD分析比较。
4) sputter
溅射
1.
Cu films sputtered with applied magnet under substrate and their microstructures;
基片下磁场中溅射镀铜薄膜及其微结构
2.
Zinc Oxide Thin Films Prepared Using Microwave ECR Plasma Sputtering Method;
微波电子回旋共振等离子体溅射法沉积ZnO薄膜
3.
Study of TiN Thin Film by Microwave ECR Plasma Reaction Sputtering Deposition;
微波ECR等离子体溅射沉积TiN薄膜的研究
5) magnetron sputtering
磁控溅射
1.
Preparation and characterization of anti-bacterial nonwovens by magnetron sputtering rare-earth activated TiO_2 onto PET fabric;
磁控溅射制备稀土激活TiO_2复合抗菌非织造布
2.
Effect of depositing process on microstructure chromium nitride coatings deposited by reactive magnetron sputtering;
反应磁控溅射沉积工艺对Cr-N涂层微观结构的影响
3.
Characterization study of Al magnetron sputtering coating on AZ31 magnesium alloy;
AZ31镁合金磁控溅射镀铝膜的性能研究
6) sputtering target
溅射靶材
1.
The current market condition and development tendency of high purity copper sputtering targets were introduced.
简要介绍了高纯铜溅射靶材目前的市场情况、现状、应用领域和未来高纯铜溅射靶材发展趋势;并对高纯铜溅射靶材的特性要求以及微观组织控制做了简单的阐述。
2.
ZAO thin films have a wide application prospect owing to its perfect optical and electrical characteristics(ZAO thin films prepared with a sputtering target doped with Al_2O_3 (3% mass fu.
由于其优良的光电特性(用掺杂Al2O3质量分数达3%的溅射靶材可制备电阻率达4。
参考词条
补充资料：单线态-单线态能量转移
分子式：
CAS号：
性质：处于电子激发单线态的能量给体，通过激发能的转移使能量受体处于激发单线态的过程。
CAS号：
性质：处于电子激发单线态的能量给体，通过激发能的转移使能量受体处于激发单线态的过程。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。