1) lead-free solder
无Pb焊料
1.
In the road-line map of the lead-free soldering for electronic packaging, the devel opment and application of the lead-free solder coating on Cu matrix is a key step.
本文给出一种碱性焦磷酸盐镀液及其电沉积工艺,以获得Sn-Ag无Pb焊料的可焊性镀层。
2) Pb/Sn solder
Pb/Sn焊料
3) Pb-free solder
无铅焊料
1.
This paper describes the development background,kinds,required characleristic,processes and future theme of Pb-free solder plating.
概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
4) lead-free solder
无铅焊料
1.
Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy;
稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响
2.
Effect of cerium on the structure and properties of Sn-Ag-Cu lead-free solder;
Ce对SnAgCu系无铅焊料合金组织和性能的影响
3.
Properties of Sn-Zn alloys as lead-free solders;
亚共晶Sn-Zn系合金无铅焊料的性能
5) lead-free
[英][,led 'fri:] [美]['lɛd 'fri]
无铅焊料
1.
RoHS law endorsed by EU on electronic products quickens the tendency of lead-free solders.
文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。
2.
Recently,lead-free solders are replacing Sn-Pb solders because of human health and the environmental protection and legal regulation worldwide.
近年来环境和人类健康保护的要求和有关国际法规的压力使世界电子工业面临以无铅焊料代替传统锡铅焊料的迫切需求。
6) lead-free solders
无铅焊料
1.
Life cycle assessment of lead-free solders;
无铅焊料的环境协调性评价
2.
Clean Question of Lead-Free Solders in Electronic Assembly Application Process;
无铅焊料在电子装配应用过程中的清洗问题研究
3.
The lead-free solders by adding small amount of high melting point metals based on SnAgCu,SnAgBi and SnZn solders were prepared respectively.
研究了在SnAgCu、SnAgBi、SnZn三个系列无铅焊料中添加质量分数为0。
补充资料：镉焊料
分子式：
CAS号：
性质：含82％镉、18％锌的合金。又称镉钎焊合金。工业上广泛用于焊接工艺。熔融法制备。
CAS号：
性质：含82％镉、18％锌的合金。又称镉钎焊合金。工业上广泛用于焊接工艺。熔融法制备。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条