The progress of electromigration in bump interconnect;

The interface structures of solder droplet for SnPb and SnAgCu Al/Ni/Cu pad were investigated by droplet direct laser fabrication method,which is compared with the interface structures for bump and pad under laser reflow bumping.

Some "solder bumping" setup on the LTCC circuit substrate grounding so.

Computing global color feature by at the extracting color information location of salient point can optimally capture local image information, and be more robust for detecting the change of orientation along image contour Experiment shows such an approach can improve significantly retrieval result

An improved algorithm of convex hull based on the super ball’s lamella is proposed in terms of the character that only the outmost points of the convex set may be the convex points and the points nearby the center of the convex set can not be ones.

In convex hull,some points in the convex hull,such as the points lie in the line between the two convex points but not convex points.

Experiments were carried out to investigate an area-array SnAg alloy electroplating solder bumping process with a bump size of less than 100μm.

With the rapid development of electronic packaging technology and the rise of the lead free trend, the research of reaction between solder bump and under bump metallurgy(UBM)becomes a hot topic in flip chip tech- nology.