1) solder bump
钎料凸点
2) immersion solder bumping
浸渍钎料凸点
3) molten solder droplet bumping(MSDB)
钎料熔滴凸点制作(MSDB)
4) Solder bump
焊料凸点
1.
In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps.
回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展。
5) brazing alloy
钎料
1.
Properties and welding interface characterization of new-type Au-Ag-Ge brazing alloy;
新型Au-Ag-Ge钎料的性能及焊接界面特征
2.
The results indicate that the base metal, 60wt%BNi2+40wt%BNi5 brazing alloy and BNi2 brazing alloy is with similar passivation current, but the initial passivation potential is increased in turn, which demonstrates that their corrosion resistance is decreased in the same sequence.
通过电化学方法研究了钎料分别为60%BNi2+40%BNi5(质量分数)和BNi2的316L不锈钢钎焊接头在人造海水中的耐腐蚀性能。
6) filler metal
钎料
1.
The vacuum brazing process of 5CrMnMo steel and YG8 hard metal were studied by using CuMnNi filler metal.
选用CuMnNi钎料,研究了5CrMnMo钢与YG8硬质合金的真空钎焊工艺。
2.
The filler metals and fluxes suitabled for 2A50 aluminum alloy brazing were selected according to the feature of 2A50 aluminum alloy and the test of spreadability and clearance fillabitity.
针对2A50铝合金的特点,根据铺展性、填缝性试验,对适合其钎焊的钎料与钎剂作了选择,进行了接头强度试验。
补充资料：钎料
分子式：
CAS号：
性质：为实现两种材料（或零件）的结合，在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料（熔点低于450℃的钎料），硬钎料（熔点高于450℃的钎料）。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。
CAS号：
性质：为实现两种材料（或零件）的结合，在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料（熔点低于450℃的钎料），硬钎料（熔点高于450℃的钎料）。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条