1) thermal insulation
热阻值
1.
We test seven pieces of partial moist cotton woven and two others partial moist woven th en we gain values of their thermal insulation.
本文模拟人体出汗局部润湿的实际情况 ,选取了 7块具有代表性的棉机织物 ,作为对比的 1块麻机织物和 1块人造棉机织物 ,采用保鲜膜覆盖局部润湿织物的方法 ,测试织物在局部润湿状态下的热阻值 ,对实测数据进行了比较分析 ,并利用Origin 5 0进行绘
2) Garment Thermal Resistance
服装热阻值
3) thermal resistance
热阻
1.
Mechanism of heat transfer enhancement for converging-diverging tubes and thermal resistance distribution;
应用热阻分析缩放管强化传热机理
2.
Study of thermal resistance of burn-in model of VLSI;
VLSI老化模型参数热阻的研究
3.
A novel measuring method of thermal resistance for high power LED;
一种高功率LED热阻的测试方法
4) heat resistance
热阻
1.
Research on the forecast of heat resistance and moisture resistance of fabrics;
织物热阻和湿阻的预测研究
2.
Experimental study on heat resistance under variational double glazing air layer thickness;
双层玻璃空气层厚度变化对热阻影响的实验研究
3.
It shows the value of clo can only suit to evaluate the insulating ability of the apparel to the noticeable heat fluid, and the value of clo obtained from the heat resistance of fabrics doesn't accord with the original definition.
分析了clo值的定义,指出了clo值只适合于评价服装对显热流的隔热作用、由热阻折算得到的织物clo值已不符合原定义。
5) Thermal resistor
热阻
1.
The measurement method of thermal resistor for power LED based on electrical parameters measurment is analyzed.
分析了功率发光二极管(LED)基于电学测量的热阻的测量方法,介绍了采用高性能数据采集卡构建了新型的功率LED热特性自动测量分析系统,实现对功率LED结温和热阻的精确、简便的测量。
2.
Traditionally the steady thermal performance of packaged semiconductor device has been characterized with a single junction-to-case thermal resistor.
在传统单芯片封装热阻定义的基础上,针对多芯片组件(MCM)传统热阻表示方法的不足,基于线性叠加原理,采用有限元模拟技术,提出了MCM的结到壳的热阻表示方法——热阻矩阵,并利用有限元模拟方法对热阻矩阵进行了验证。
6) interface thermal resistance
界面热阻
1.
This paper introduces the main steps of the emulation of low-temperature interface thermal resistance between Al and Al with the method of non-equilibrium molecular dynamics, makes comparison of and analysis on the emulating results and experimental results, and points out the reasons of the errors.
介绍了用非平衡态分子动力学对低温Al与Al之间界面热阻仿真的主要步骤,并对仿真结果与实验结果进行了比较分析,指出了出现误差的原因。
2.
It is found that the thermal conductivity and the proportion of interface thermal resistance to total thermal resistance have no relation with the number of periods for the superlattice structure with a fixed period length.
模拟结果显示 ,周期长度固定的超晶格薄膜 ,界面热阻在总热阻中的比例和导热系数同周期数无关 ;当超晶格薄膜的膜厚不变时 ,导热系数将随着周期长度的增大而增大 ,但由于超晶格薄膜晶格常数的不匹配 ,使其内部发生明显的几何形变 ,这种变化关系也愈加复杂 ,同时周期长度的增加 ,平均界面热阻也随着增大 ,揭示了界面热阻不仅取决于界面层的物理条件 ,而且也与构成的介质内部形变有着重要关
3.
The interface thermal resistance was the basic science problem in the fields of cryogenics,aerospace,superconducting and microelectronic technology etc.
固体界面热阻是航空航天、低温与超导、微电子技术等领域中研究热点问题,氮化铝陶瓷和金属铜被广泛应用于低温超导装置和集成电路芯片。
参考词条
补充资料：负温度系数热敏电阻陶瓷(见热敏陶瓷)
负温度系数热敏电阻陶瓷(见热敏陶瓷)
thermo-sensitive ceramics with negative temperature coefficient
负温度系数热敏电阻陶瓷thermo一sensitiveeeramies with negative temperature eoeffieient在某一特定温度范围，电阻率随温度的升高而明显减小的热敏陶瓷。简称NTC陶瓷。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。