1)  thermal resistance factor
热阻系数
1.
Experimental investigation was conducted to study the thermal performance and thermal resistance factor of staggered mini-duct heat sinks.
实验研究微小交错流道散热块的传热性能以及热阻系数
2)  thermal resistivity of soil
土壤的热阻系数
3)  thermal resistance per kg volume
公斤体积热阻系数
4)  thermal resistance
热阻
1.
Mechanism of heat transfer enhancement for converging-diverging tubes and thermal resistance distribution;
应用热阻分析缩放管强化传热机理
2.
Study of thermal resistance of burn-in model of VLSI;
VLSI老化模型参数热阻的研究
3.
A novel measuring method of thermal resistance for high power LED;
一种高功率LED热阻的测试方法
5)  heat resistance
热阻
1.
Research on the forecast of heat resistance and moisture resistance of fabrics;
织物热阻和湿阻的预测研究
2.
Experimental study on heat resistance under variational double glazing air layer thickness;
双层玻璃空气层厚度变化对热阻影响的实验研究
3.
It shows the value of clo can only suit to evaluate the insulating ability of the apparel to the noticeable heat fluid, and the value of clo obtained from the heat resistance of fabrics doesn't accord with the original definition.
分析了clo值的定义,指出了clo值只适合于评价服装对显热流的隔热作用、由热阻折算得到的织物clo值已不符合原定义。
6)  Thermal resistor
热阻
1.
The measurement method of thermal resistor for power LED based on electrical parameters measurment is analyzed.
分析了功率发光二极管(LED)基于电学测量的热阻的测量方法,介绍了采用高性能数据采集卡构建了新型的功率LED热特性自动测量分析系统,实现对功率LED结温和热阻的精确、简便的测量。
2.
Traditionally the steady thermal performance of packaged semiconductor device has been characterized with a single junction-to-case thermal resistor.
在传统单芯片封装热阻定义的基础上,针对多芯片组件(MCM)传统热阻表示方法的不足,基于线性叠加原理,采用有限元模拟技术,提出了MCM的结到壳的热阻表示方法——热阻矩阵,并利用有限元模拟方法对热阻矩阵进行了验证。
参考词条
补充资料:正温度系数热敏陶瓷阻-温特性曲线
分子式:
CAS号:

性质:描述正温度系数热敏陶瓷电阻率与温度关系的曲线。钛酸钡基PTC热敏陶瓷阻-温特性曲线。电阻率随着温度的升高,先是降低,当达到某一值Tmin时,曲线出现极值,经过极值后电阻率随温度升高而急剧上升,此时对应的温度Tb称为开关温度。电阻率随温度上升达到最大值时所对应的温度为Tm。经过Tm后,阻温特性曲线发生弯曲,电阻率开始逐步降低,此时对应的温度为Tp。温度处于Tb至Tm之间时,热敏陶瓷呈现正温度系数(PTC)特性。其电阻温度系数αT= ,式中Rb,Rp为Tb,Tp温度下的相 应零功率电阻值。αT大于10%/℃,为开关型热敏陶瓷电阻器。αT小于10%/℃,为缓变型热敏陶瓷电阻器。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。