1)  thermosonication
热超声波
2)  manothermosonication
压热超声波
3)  Thermosonic
热超声
1.
Application of Thermosonic for Crack Detection;
热超声技术在裂纹检测中的应用
2.
Synchronization trigger system design of thermosonic flip-chip bonding;
热超声倒装键合同步触发系统的设计
3.
Based on the distribution of electrodes for power GaN blue LED chip,Au bumps on Si were fabricated by electroplating,and then the LED chips were welded to Si carrier by thermosonic FCB.
结合功率型GaN基蓝光LED芯片的电极分布,在硅载体上电镀制作了金凸点,然后通过热超声倒装焊接技术将LED芯片焊接到载体硅片上。
4)  ultra-stable
水热超稳
1.
The ultra-stable zeolite DASY 2.
对工业用水热超稳分子筛 DASY 2。
5)  thermosonic bonding
热超声键合
1.
Dynamic characteristics study of piezoelectric transducer for thermosonic bonding;
热超声键合压电换能器的动力学特性
2.
The system of the ultrasonic transducer is the key component of the bonding equipment in the thermosonic bonding system.
在热超声键合系统中,超声换能系统是键合装备的核心部分。
6)  thermosonic packaging
热超声封装
1.
The dynamic optimum design of high-frequency ultrasonic transducer was studied to improve thermosonic packaging efficiency and reduce packaging temperature.
为提高热超声封装效率、降低封装温度,研究了高频超声换能器的动力学优化设计。
参考词条
补充资料：CLY-1型超声波在线粒度分析仪


CLY-1型超声波在线粒度分析仪


　　黔CLY一l型超声波在线粒度分析仪
　　
说明：补充资料仅用于学习参考，请勿用于其它任何用途。