1.
Non-Cyanide Silver Electroplating Using DMH as Complexing Agent and Investigation on Electrodeposition Behaviors;
基于DMH为配位剂的无氰电镀银工艺及电沉积行为研究
2.
Process of non-cyanide silver plating for molybdenum foils used as inter-links of solar cell array system in space vehicle
航天器太阳能电池阵互连片钼箔无氰电镀银工艺
3.
Silver recovery and cyanide removal from silver-plating wastewater using pulse-electrolysis
脉冲电源电解处理含氰含银电镀废水
4.
Appliance of IrO_2-RuO_2/Ti Electrode in Pulse Electrolysis of Electroplating Wastewater Containing Cyanide and Silver
IrO_2-RuO_2/Ti电极处理含氰含银电镀废水
5.
Safeguard of Solution and influence of Impurities for Non- Cyaniding Silver Electroplating
无氰镀银溶液的维护及杂质对镀层质量的影响
6.
Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;
无氰电镀22K金—铜合金工艺研究
7.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
8.
Investigation on Cyanide-free Alkaline Copper Electroplating and Eletrochemical Behavior
无氰碱性镀铜工艺及其电化学过程的研究
9.
Treatment of cyanide-containing wastewater and waste residue from cyanide electroplating bath
氰化电镀槽液和含氰废水、废渣的处理
10.
Study on Additives in Gold electroplating for a Cyanide-free Bath
一种新型无氰镀金配体及添加剂研究
11.
Study on Cyanide-free Eletroless Nickel Plating Process on AZ91D Magnesium Alloy
AZ91D镁合金无氰浸锌化学镀镍的研究
12.
Cyanide-free copper electroplating in sulfite/thiosulfate bath
亚硫酸盐/硫代硫酸盐体系无氰镀铜
13.
Treatment of Electroplating Waste Water Containing Cyanide with Sodium Hypochlorite;
用次氯酸钠处理电镀工业的含氰废水
14.
Advances in experimental study and production practice of cyanide-free copper plating--Part Ⅱ
无氰镀铜的实验研究与生产应用进展(二)
15.
Process for Cyanide-Free Copper Electroplating of Aluminum Alloy and Its Application on Automobile Wheels Made of Aluminum Alloy
无氰高密度镀铜工艺及其在汽车轮毂中的应用
16.
Advances in experimental study and production practice of cyanide-free copper plating-Part I
无氰镀铜的实验研究与生产应用进展(一)
17.
Microstructure and Properties of Cyanide-Fret Pulse-Plated Galvanizing Coating on AZ31B Magnesium Alloy
AZ31B镁合金无氰脉冲镀锌层的结构与性能
18.
Effect on the release of the Ni ion for the nickel-chromium alloy with non-cyanide gold-plated layer treatment
无氰镀金对镍铬合金Ni离子析出的影响