1) immersion silver
浸镀银
1.
Deposition process of immersion silver plating onto copper substrate in silver nitrate aqueous solution;
铜基材硝酸银溶液浸镀银的沉积过程
2.
Finishing of printed circuit board in ethylenediamine-containing immersion silver system;
印刷电路板的乙二胺络合浸镀银工艺
3.
The electrodeposition rate of immersion silver plating for printed circuit board(PCB) was measured by galvanic current method via advance electrochemical system.
利用先进的电化学系统,通过测定铜-银电偶电流,分别对有无络合剂条件下印刷电路板浸镀银的沉积速度进行测定,并将测定结果与常规的容量滴定法进行对比。
2) Immersion plating
浸镀
1.
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐,加入络合剂、光亮剂、锡盐稳定剂,研究成功了一种新的浸镀铜锡合金工艺。
2.
Use immersion plating to plate film on the glass.
以硝酸镍为起始原料,采用溶胶-凝胶法制得高稳定性的溶胶体系,用浸镀法在玻璃表面镀膜,研究了不同物质配比对溶胶稳定性和成膜性的影响,利用DTA、IR、XRD分析了凝胶和薄膜的结构,确定了氧化镍薄膜的制备条件;溶胶制备温度为60～80℃,pH=4,镀膜热处理温度为300～350℃,时间2h。
3.
In this paper, the characteristic, electrochemistry principle and technological controls of immersion plating depositions were reviewed, which are keen surface technology in electronic field.
本文介绍了当前电子行业热门的表面技术-浸镀处理的特点、机理及其工艺控制。
3) immersion
[英][ɪ'mɜ:ʃn] [美][ɪ'mɝʃən]
浸镀
1.
On the microstructure of immersion silver on sputtered copper;
溅射铜基材上浸镀银的微结构表征(英文)
2.
In the paper,the mechanism,rudimental process and surface morphology of the immersion silver and immersion tin on PCB are studied contrastively.
浸镀是印刷电路板(PCB)终饰工艺中的主流技术。
4) dip plating
浸镀
1.
The unfeasibility of dip plating of copper on iron and steel workpiece from a bright acid copper sulfate bath and the features of acid copper plating process characterized by the combination of dip plating with electrodeposition were analyzed.
分析了基于硫酸盐光亮酸性镀铜体系的钢铁件浸镀铜工艺工业化应用的不可行性,以及浸镀与电沉积相结合的酸性镀铜工艺的特点。
5) silver plating
镀银
1.
Technical specification in cyanide silver plating;
氰化镀银工艺中的几个技术问题
2.
Acoording to the surface appearance and the microhardness of coating,the parameters of silver plating with pulse current are optimized by the rthorhombic experiment.
以镀层表面形貌和显微硬度为考核指标,采用正交试验法优选了脉冲镀银参数,采用优选的脉冲参数电镀与直流电镀的银镀层作了比较。
6) silver electroplating
镀银
1.
The working principle and main functions of a silver electroplating line is briefly introduced.
简要介绍镀银生产线的工作原理及主要功能。
2.
In order to improve its conductivity, silver electroplating was applied.
详细介绍了在铍青铜上电镀银的工艺过程，并提出了几种对所得银镀层进行防变色处理的方法。
补充资料：镀银
将银镀在玻璃和金属表面的技术，旨在利用金属银的优良导电性、抗腐蚀性和反光性能。镀银有化学镀和电镀两类。化学镀银是用酒石酸或糖还原银氨配离子Ag(NH3)娚中的一价银，使金属银沉积在玻璃上，生成光亮的银镜。暖水瓶镀银是化学镀银的典型例子。电解镀银是将银氰配离子Ag(CN)娛作电解液,用电解方法将金属银沉积在其他金属的表面。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条