Through the product was heat-treated under medium temperature and then impregnated with silver under high temperature and pressure in isostatic heat press.

Deposition process of immersion silver plating onto copper substrate in silver nitrate aqueous solution;

Finishing of printed circuit board in ethylenediamine-containing immersion silver system;

The electrodeposition rate of immersion silver plating for printed circuit board(PCB) was measured by galvanic current method via advance electrochemical system.

Discussion on the cause of low silver leaching rate taken place in gold and silver cyanide leaching and ways to increase it;