当前类别:材料英语
晶圆调平:wafer leveling
晶圆测试完毕信号:wafer end
晶圆测试/探针测试:wafer test/probe test
晶圆表面雷射扫描器:laser soldering laser surface scanner
晶圆表面检查:wafer surface inspection
晶圆表面灰尘检查:inspection of dust particle on wafer
晶圆变形:wafer distortion
晶圆边缘曝光球状物去除:optical edge bead removal
晶圆保持器:wafer holder
晶体粘合剂:crystal adhesise
晶体清洗剂:crystal cleaning agent
晶体结构:Crystal structure
晶丝纤维:whisker fibers
晶丝:whiskers
晶片:wafers
晶癖面:habit plane
晶粒微化温度:Grain refining temperature
晶粒微化:Grain refinement
晶粒生长:grain growth
晶粒取向电器用硅钢片:Grain-Oriented Electrical Steel
晶粒化温度:Grain coarsening temperature
晶粒度,晶粒大小:Grain size
晶粒粗化:grain coarsening
晶粒[反光]对比:Grain contrast
晶粒:crystal grain
晶界侵蚀:Grain boundary attack
晶界反应:Grain boundary reaction
晶格间氧气,格隙氧气:interstitial oxygen
晶锭旋转切割机:rotating ingot slicing machine
晶锭切断面弯曲:ingot cutting face bow
晶锭端面弯曲测式系统:ingot end face measuring system
晶锭:billet
经由透镜自动聚焦:through-the-lens auto focusing
经由透镜对准:through-the-lens alignment
经由标线片对准:through-the-reticle alignment
经纱上浆:warp sizing
经纱:warp yarn
经氢气退火之晶圆:hydropgen annealed wafer
经抛光晶圆:polished wafer
经磨光晶圆:lapped wafer
浸渍式蚀刻系统:immersion wet etching system
浸渍:impregnation
浸置式显影:puddle developing
浸涂防粘隔离剂:antisticking agent
浸酸篮:pickle basket
浸热:soaking
浸焊剂装置:solder dipping machine
浸焊测试系统:solder dip test system
进模口2闸:gate1
进步型气冷反应器:gas-cooled reactor