1) optical waveguide packaging
光波导器件封装
1.
Based on the multi-body system theory,the universal volumetric error of a four-campaign platform model process is described in detail and an ideal modeling technique of the accuracy of analysis and error compensation for optical waveguide packaging equipment campaign platform is also provided.
平面波导芯片与阵列光纤之间的对准,主要依靠器件封装设备运动平台的六维全空间亚微米精度运动控制,来实现其精确定位对准,基于多体系统理论,阐述四轴运动平台综合空间误差的建模过程,为阵列光波导器件封装设备运动平台的精度分析和误差补偿,提供一种理想的建模技术。
2) optical waveguide device
光波导器件
1.
The method discussed in the paper is also applicable for the analysis of more complicated optical waveguide devices.
该方法可用于分析结构更加复杂的光波导器件。
2.
The recent progress of planar optical waveguide devices reported on OFC 2003 has been overviewed and the emphasis is stressed on the progress of novel materials,new technology and novel structures used for planar optical waveguide devices.
概述了2003年OFC会议上报道的平面光波导器件,着重介绍了平面光波导器件在新材料、新工艺、新结构方面的新进展和发展方向。
3) optoelectronics device packaging
光电子器件封装
1.
Flip-chip interconnect technology in optoelectronics device packaging;
倒装芯片互连技术在光电子器件封装中的应用
4) optical planar waveguide devices
平面光波导器件
5) guided-wave optoelectronic devices
导波光电子器件
6) LiNbO_3 optical wavegulde
LiNbO_3光波导器件
补充资料：光波
光①。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条