1.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术
2.
Light Source Analysis and Design of Machine-vision for Array Waveguide Bonding
阵列波导器件封装中机器视觉系统的光源分析与设计
3.
Research and Development of Planar Waveguide Circuit's Packaging Software
平面波导器件封装工艺软件的研究与开发
4.
Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device
阵列波导器件封装用UV胶粘接力学性能分析
5.
The tully metallized optical fiber insert pin for metallized coupling package of optoelectronic devices is reported for the first time.
本文首次报导光电器件金属化耦合封装用全金属化光纤插针;
6.
Theoretical and Experimental research on the Coupling of 4×4 Integrated Optical Waveguide Switch;
4×4光波导开关耦合封装的理论与实验研究
7.
Study on the Key Techniques of Fiber Active Devices Packaging with Laser Welding;
光纤有源器件激光焊接封装的关键技术研究
8.
Study on the SOI-MMI Optical Waveguide Units and Optical Switches;
SOI-MMI光波导器件与光开关研究
9.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
10.
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
非制冷980nm半导体激光器封装设计与热特性分析
11.
Studies on Grating-based Planar Waveguide Demultiplexers;
光栅型平面光波导波分复用器件的研究
12.
Power Semiconductor Devise and Packaging Advances Target Automotive Applications
面向汽车应用的功率半导体器件与封装
13.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
14.
Studies of the Optical Waveguide Theory and Its Applications in Arrayed Waveguide Grating Wavelength Division Multiplexer;
光波导理论及其在阵列波导光栅波分复用器件中的应用
15.
Parallel Higher-Order FDTD Simulation for Optical Waveguides;
光波导器件的高阶FDTD并行仿真分析
16.
Optical Waveguide Devices and Their anti-reflection Coatings in Silicon-on-Insulator;
SOI光波导器件及其增透膜的研究
17.
Study of Ⅲ-Ⅴ MQW Planar Waveguide Light-device;
Ⅲ-Ⅴ族半导体MQW平面波导光器件的研究
18.
Planar Waveguide Devices Based on Novel Arrayed Waveguide Gratings for Wavelength Division Multiplexing and Access Networks
基于新型阵列波导光栅的波分复用和接入网平面波导器件