1) Reflow Oven
回流焊炉
1.
Discussion on the Lead-free Measure of Reflow Oven
回流焊炉的无铅化对策探讨
2) reflow oven
回流焊炉,回溶焊炉
3) Parameters of reflow oven
回流焊炉工艺参数
4) reflow soldering
回流焊
1.
Realization of minitype SMT reflow soldering oven s PID controller;
小型SMT回流焊炉的PID控制实现
2.
Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint
回流焊对SnAgCu焊点IMC及剪切强度的影响
3.
Design of Reflow Soldering temperature testing device
回流焊温度测试装置的设计
5) Reflow
[英][ri:'fləu] [美][ri'flo]
回流焊
1.
5Cu were analyzed by scanning electron microscopy(SEM) and microscope,when reflows were carried out many times.
结果表明:随着回流次数的增加,焊点的宽度和金属间化合物的厚度增加;焊料和凸点下金属化层(UBM)之间界面上的IMC组织从针状逐渐粗化;焊料的拉伸强度有轻微变化;断裂面第一次回流焊后出现在焊料中,而多次回流焊后断裂面部分出现在焊料中,部分出现在UBM和焊料的界面中。
2.
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
6) Reflow soldering
回流焊接
1.
Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package,PCB design,solder paste print,place BGA,and reflow soldering process.
从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。
2.
Reflow soldering is a key chain in the SMT ,the function of the reflow soldering stove is to provide a requested-temperature condition on which the solders is melt and then cooling and becomes solid to form a soldering drop.
回流焊接是SMT工艺流程中重要的一环,回流焊炉的作用是提供一定的温度环境使焊锡膏熔化、而后降温固化在PCB上形成焊点。
补充资料:回流
分子式:
CAS号:
性质:指在精馏操作中,从精馏塔顶部引出的上升蒸气经冷凝器冷凝后,一部分液体作为馏出液(塔顶产品)送出塔外,另一部分液体送回塔内,后者称为回流。塔顶的液相回流和塔釜(或再沸器)的蒸气流上升是保证精馏过程连续稳定进行的必要条件。
CAS号:
性质:指在精馏操作中,从精馏塔顶部引出的上升蒸气经冷凝器冷凝后,一部分液体作为馏出液(塔顶产品)送出塔外,另一部分液体送回塔内,后者称为回流。塔顶的液相回流和塔釜(或再沸器)的蒸气流上升是保证精馏过程连续稳定进行的必要条件。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条