1.
Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint
回流焊对SnAgCu焊点IMC及剪切强度的影响
2.
At least3 years in design/ quality improvement for product such as re-flow oven, wave solder machine.
至少3年以上回流焊、峰焊设计与质量改进经验。
3.
Clear how to measuring reflow and wave profile.
清楚怎样测量回流焊和波峰焊温度曲线。
4.
Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;
无铅回流焊冷却速率对焊点质量的影响
5.
Effect of reflow soldering on the IMC and shear strength of Sn-0.3Ag-0.7Cu-xBi/Cu solder joints
回流焊对SnAgCuBi/Cu焊点IMC及剪切强度的影响
6.
The Design and Development of the Electrical Control System for SMT Solder-reflow Machines;
SMT回流焊设备电控系统的设计开发
7.
The Study on Computer Control System of Multitemperatual Zones Refolw Soldering;
多温区回流焊计算机控制系统的研究
8.
Development of precise inverter reflow-soldering power supply with waveform control
波控逆变式精密回流焊接电源的研制
9.
Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering
SiP器件回流焊时湿热应力的分析
10.
Are AOI/ AXI complementary methods, which include solder joint inspection, used for all reflowed parts?
AOI/AXI的检验方法包括焊接点的检验,是否用于回流焊元件检测?
11.
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
12.
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
13.
Software design of reflow soldering temperature measurement system based on VB
基于VB的回流焊温度测试系统软件设计
14.
Defect Analysis and Solutions for TAB Used in Two-times Reflow
TAB在二次回流焊接中的缺陷分析及解决办法
15.
Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?
回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?
16.
Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.
在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
17.
Does the product Temperature Profile meet the reflow requirements for the SMT components according to the component manufactures?
产品的温度曲线是否符合零件制造商提供的SMT零件回流焊要求?
18.
Optimization and Control of Reflow Soldering Profile in SMT Line;
表面贴装工艺生产线上回流焊曲线的优化与控制