A reagent for removing lead of alkaline waste etching liquid and its removing lead rate equation by quadratic orthogonal designing;

Some experimental methods for the treatment of ammonia etching wastewater are introduced.

Nanometer copper powders were prepared from acidic waste etching solution containing copper using hydrazine hydrate as a reductive agent.

Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, microelectro-mechanical system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleclroless nickel, recycling of alkaline etching solution and reclaiming system of copper.