1) magnetron sputtering & coating technique
磁控溅射镀膜技术
1.
The magnetron sputtering & coating technique has been widely used in the film preparation field,and the design of the control system has important influence on the stable operation of magnetron sputtering & coating equipment.
磁控溅射镀膜技术在薄膜制备领域广泛应用,控制系统的设计对磁控溅射镀膜设备的稳定运行有着重要的影响。
2) Magnetron sputtering
磁控溅射镀膜
1.
This design aims at the characteristics of magnetron sputtering deposition, and mainly ameliorate the design of the chamber of the magnetron sputtering machine.
本设计主要对磁控溅射镀膜机真空室进行改进设计,以改善磁控溅射镀膜的工艺条件。
4) magnetron sputtering technique
磁控溅射技术
1.
Conclusion:Titanium film with nanoparticle sizes,which was formed by direct-current magnetron sputtering technique,can improve materials\' surface properties and enhance the biocompatibility.
结论:利用直流磁控溅射技术在纯钛表面形成的纳米粒度的钛膜,可以改善钛表面的性能,提高其生物相容性。
5) unbalanced magnetron sputter ion plating technique
非平衡磁控溅射离子镀技术
1.
A series of CrTiAlN hard gradient coatings were produced using the closed field unbalanced magnetron sputter ion plating technique on M2 high speed steel and Si substrates with substrate bias voltage changing,and the friction and wear properties were studied.
应用闭合场非平衡磁控溅射离子镀技术在高速钢和单晶硅基体上制备了一组随基体偏压变化的CrTiAlN梯度镀层,并测试了其摩擦学性能。
6) magnetron sputter ion plating
磁控溅射离子镀
1.
Electrochemical corrosion behaviors of depleted uranium coated with niobium deposited by magnetron sputter ion plating were studied by electrochemical technology, scanning electron microscope (SEM) and X–ray energy dispersive spectroscope (EDS).
利用电化学测试技术、扫描电镜(SEM)及X射线能谱(EDS)对磁控溅射离子镀铌贫铀的电化学腐蚀行为进行了研究。
2.
An experiment of depositing TiN coating on the surface of HSS W18Cr4V by magnetron sputter ion plating (MSIP) method was carried out.
采用磁控溅射离子镀法(MSIP)对高速钢W18Cr4V进行了TiN镀膜试验,对镀膜后试样的各项性能进行了测试分析,并对溅射时间、氮分压、溅射电流等工艺参数对TiN膜层的显微组织、厚度、硬度和耐磨性的影响进行了研究,确定了可获得最佳涂层综合性能的镀膜工艺参数。
3.
By using the physical vapor deposition(PVD) coating technology of closed field unbalance magnetron sputter ion plating(CFUBMSIP),the high-speed steel(HSS) twist drills with graded CrAlTiN coatings are made.
用闭合场非平衡磁控溅射离子镀PVD涂层工艺在高速钢麻花钻上沉积了CrA lTiN梯度涂层。
补充资料：磁控溅射
分子式：
CAS号：
性质：用一个环形永久磁体在乎板形靶上产生环形磁场，在磁场作用下，电子被约束在一个环状空间内，形成高密度的等离子环。在等离子环内，电子不断地使Ar原子变成Ar离子，Ar离子被加速后打向靶表面，把靶内的原子溅射出来，沉积在基片上形成薄膜。若靶材为导体，溅射电源可用直流或射频电源，如靶材是绝缘体，则必须用射频电源。用多源共溅射加后处理法可制备双面薄膜。将基片放置在靶中心线上，称为正轴溅射，基片放在靶轴线外；称为偏轴溅射。磁控溅射是广泛采用的制膜方法。
CAS号：
性质：用一个环形永久磁体在乎板形靶上产生环形磁场，在磁场作用下，电子被约束在一个环状空间内，形成高密度的等离子环。在等离子环内，电子不断地使Ar原子变成Ar离子，Ar离子被加速后打向靶表面，把靶内的原子溅射出来，沉积在基片上形成薄膜。若靶材为导体，溅射电源可用直流或射频电源，如靶材是绝缘体，则必须用射频电源。用多源共溅射加后处理法可制备双面薄膜。将基片放置在靶中心线上，称为正轴溅射，基片放在靶轴线外；称为偏轴溅射。磁控溅射是广泛采用的制膜方法。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条