2) Al-base solder
铝基钎料
1.
In this paper, Cu and Ni are chosen to be added to Al-base solder and the effects of Cu, Si and Ni on the melting-point of solder are studied by Probability&Statistic design.
以Cu、Ni作为主要的添加元素 ,通过正交试验的方法研究了合金元素Cu、Ni、Si对铝基钎料熔点的影响。
3) Pd based brazing alloy
Pd基活性钎料
4) Cu-based active filler metal
Cu基活性钎料
5) Ti-based active solder
钛基活性钎料
6) Sn-based active solder
锡基活性钎料
补充资料:135kA中间下料预焙阳极铝电解槽(抚顺铝厂)
135kA中间下料预焙阳极铝电解槽(抚顺铝厂)
赢 135kA中间下料预焙阳极铝电解槽(抚顺铝厂)
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条