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1)  node reliability
节点可靠性
2)  reliable node
可靠节点
1.
A brand new method is designed for indoor environment,which is filtering the reliable nodes and dealing with the received signal strength indicator(RSSI)with Gauss model.
并根据室内的实际情况提出了筛选可靠节点和使用高斯模型处理数据的方法,从而挑选出更为合适的接收信号强度指示器(RSSI)值进行定位计算。
3)  unreliable node
不可靠节点
4)  nodes reliability
节点可靠度
5)  solder joint reliability
焊点可靠性
1.
Integrating with the experience of practical work, the void phenomenon of Ball Grid Array and the emergent mechanism of void were discussed in the paper, and the influence of void on solder joint reliability were discussed on emphasis.
结合实际工作中的经验和体会,探讨球栅阵列元器件焊点的气孔现象及其产生机理,重点讨论气孔与焊点可靠性的关系,认为非焊点与基板界面处(IMC)及焊点和BGA的Substrate结合处的气孔对焊点可靠性的影响不是很显著。
2.
With the change of material and technics in electronic packaging,it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。
3.
And the influence of Cr on solder joint reliability has been studied.
此外,本文还采用时效的方法研究了Sn-Zn-Bi合金与Cu和Ni基底钎焊的焊点界面反应和界面金属间化合物长大行为,并探讨了Cr对Sn-Zn-Bi合金的焊点可靠性的影响。
6)  Reliability of solder joints
焊点可靠性
1.
Because of the high integration level of electronic packaging, evaluating solder joints reliability is more and more difficult, and lead-free packaging also bring new problems to the research on reliability of solder joints.
电子封装高度集成化,使得焊点可靠性评估更加困难,而封装无铅化,又给焊点可靠性研究带来新的问题。
补充资料:节点
分子式:
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性质:  又称结点。是有向图中的符号。将工艺流程图抽象为信息流程图时,常用有向图来表示。有向图由节点和有向支线构成,用来表达流程信息结构。节点通常与单元设备对应(但不必严格地一一对应),有向支线则与流股相对应。这种表达是矩阵表示的基础。

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