1) reliability of ignition
点火可靠性
2) fire reliability
发火可靠性
1.
The paper mainly discuss the influence of the drawing technology and the warious type of lead cannula on the delay precision and fire reliability.
文章着重论述了延期药采用不同拉拔结构及采用不同型号的装药铅管,对于雷管的延期秒量精度及雷管发火可靠性的影响因素。
2.
To meet the requirements of fire reliability and safety reliability,the reliability index is transformed to sensitivity distribution parameter and it may control reliability of explosive initiator by modulating sensitivity during its development.
提出一种能同时满足火工品发火可靠性和安全可靠性的设计方法,把火工品可靠性指标转换成感度分布参数的取值范围,通过对感度的调节使产品满足发火可靠性和安全可靠性要求,为火工品可靠性设计提供了一条新思路。
3) solder joint reliability
焊点可靠性
1.
Integrating with the experience of practical work, the void phenomenon of Ball Grid Array and the emergent mechanism of void were discussed in the paper, and the influence of void on solder joint reliability were discussed on emphasis.
结合实际工作中的经验和体会,探讨球栅阵列元器件焊点的气孔现象及其产生机理,重点讨论气孔与焊点可靠性的关系,认为非焊点与基板界面处(IMC)及焊点和BGA的Substrate结合处的气孔对焊点可靠性的影响不是很显著。
2.
With the change of material and technics in electronic packaging,it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。
3.
And the influence of Cr on solder joint reliability has been studied.
此外,本文还采用时效的方法研究了Sn-Zn-Bi合金与Cu和Ni基底钎焊的焊点界面反应和界面金属间化合物长大行为,并探讨了Cr对Sn-Zn-Bi合金的焊点可靠性的影响。
4) Reliability of solder joints
焊点可靠性
1.
Because of the high integration level of electronic packaging, evaluating solder joints reliability is more and more difficult, and lead-free packaging also bring new problems to the research on reliability of solder joints.
电子封装高度集成化,使得焊点可靠性评估更加困难,而封装无铅化,又给焊点可靠性研究带来新的问题。
5) Reliability spot inspection
可靠性点检
补充资料：必然性，可靠性
必然性，可靠性
certainty
必然性，可靠性[沈r侧nty;月oeToaep毗T‘] 预先确信某事件毫无疑问会实现.必然性是某事件可实现性的特征，且标上了最高水平的概率.在概率论中，必然性的概念是与必然事件(certain event)和以概率l出现的事件相联系的.在实践中，只要某事件的概率充分接近于1，人们就称之为必然性事件.
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条