Study and application of electroless plating process in micro-electronic materials;

Study on lead-and cadmium-free composite additive for electroless nickel plating;

Study on electroless nickel plating on ceramic powder and it’s performance;

Hydrogen permeation measurements for electroless nickel plating process;

Applications of electroless nickel in high technological field;

Wafer bumping by electroless nickel and stencil printing;