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1)  plate copper with silver
给铜镀银
2)  The craftsman plated copper with silver.
工匠给铜镀银。
3)  Silver plating copper powder
镀银铜粉
1.
A composite conductive paint based on silver plating copper powder and epoxy resin was developed, and the effects of silver plating copper powder and coupling agent on the conductivity of paint were discussed.
研究了以镀银铜粉为导电填料的电子浆料,讨论了镀银铜粉含量、硅烷偶联剂的用量以及处理方法对导电浆料导电性能的影响。
4)  silver-coated copper powder
镀银铜粉
1.
The silver-coated copper powder was prepared with substitution reaction method.
采用置换反应法制备镀银铜粉时,铜粉还原银氨溶液中的Ag+生成的Cu2+与NH3形成络合物[Cu(NH3)4]2+,它吸附于铜粉表面而阻碍还原反应的继续进行,使制备的镀银铜粉表层的银含量降低。
5)  silver plated copper powder
镀银铜粉
1.
The relationship between the surface's unit resistance of the film with contents of silver plated copper powder and its particle size,and the contents of coupling agent were studied.
介绍了导电漆、作为导电填料的片状镀银铜粉的制备工艺流程。
6)  silverplated copper
镀银铜粉
1.
A powder with high conductivity was obtained by mechanical alloying of silverplated copper powder.
本文经过对镀银铜粉的球磨处理(以下简称CM处理粉),得到一种高导电性的粉体,由该导电粉制得的导电胶不仅导电率高、耐湿性好,而且耐银迁移性是银粉导电胶的100倍。
2.
Electrondonating amine additives were complexed with exposed copper surfaces of milled silverplated copper powder.
低价格、耐金属迁移的铜粉或镀银铜粉导电胶研究和开发越来越受到工业界重视,但铜粉或裸露铜表面的易氧化性却是制约其应用的一大难题。
补充资料:[C,C,C,C,C,C,C,C-八溴-C,C,C,C,C,C,C,C-八氯-29H,31H-酞菁合-KAPPA N29,KAPPA N30,KAPPA N31,KAPPA N32]铜
CAS:66085-74-3
分子式:C32Br8Cl8CuN8

中文名称:[C,C,C,C,C,C,C,C-八溴-C,C,C,C,C,C,C,C-八氯-29H,31H-酞菁合-KAPPA N29,KAPPA N30,KAPPA N31,KAPPA N32]铜

英文名称:[C,C,C,C,C,C,C,C-octabromo-C,C,C,C,C,C,C,C-octachloro-29H,31H-phthalocyaninato-kappa N29,kappa Copper
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